Xiaomi Industrial Fund invested in high-end packaging and testing startup Xinde Technology

Data from Qichacha shows that on August 27, Jiangsu Xinde Semiconductor Technology Co., Ltd. had a change in investors, with the addition of ten institutional shareholders including Hubei Xiaomi Changjiang Industrial Fund Partnership (Limited Partnership), and the company's registered capital increased from RMB 610 million to RMB 700 million.

Source: Qichacha

According to the official website of Xinde Technology, the company was established in September 2020 and is located in Pukou Development Park, Nanjing, Jiangsu, China. It has a total investment of 6 billion yuan and provides one-stop high-end mid- and back-end packaging and testing services, focusing on advanced packaging and testing technologies such as Bumping, WLCSP, Flip Chip PKG, QFN, BGA, SiP, SIP-LGA, BGA, FOWLP, 2.5D/3D, and Chiplet PKG. The first phase of the project operates 54,000 square meters of standardized factory buildings, mainly carrying out chip-level high-end packaging research and development and production business, introducing more than 1,000 sets of various advanced process equipment at home and abroad, and driving the employment of about 1,000 people in the surrounding area; the second phase of the project will build a chip packaging and testing base covering an area of ​​about 150 acres.

In April this year, the completion and commissioning ceremony of the first phase of Xinde Technology's high-end packaging project was held in Nanjing Pukou Economic Development Zone. The project took 6 months from construction to commissioning, with a total investment of 950 million yuan. The project's output value will reach 300 million yuan in 2021 and 1 billion yuan in 2022. It is planned to enter the listing stage within three years and reach an output value of 5 billion yuan within five years.

According to the Pukou Economic and Technological Development Zone, with the production of Huatian Technology and Xinde Technology and the signing of the contract to settle in Changjing Pulian, the Pukou Economic and Technological Development Zone has achieved the gathering of the three leading companies in the field of integrated circuit packaging and testing in China, laying a solid foundation for the park to build an integrated circuit industry landmark with global influence during the "14th Five-Year Plan" period.