Honor held a new product launch conference for Magic 3 tonight. Honor CEO Zhao Ming officially announced the Magic 3 series and officially announced that it is equipped with the latest Qualcomm Snapdragon 888 Plus chip.
Qualcomm President and CEO Amon appeared at the press conference and praised Honor's chip optimization capabilities. The Honor Magic 3 series is equipped with the latest 5nm Qualcomm Snapdragon 888 Plus chip, which uses Honor's advantage chip bottom-level optimization capabilities and self-developed technologies such as OS Turbo X and GPU Turbo X to fully unleash the power of Qualcomm Snapdragon 888 series chips.
The new GPU Turbo X graphics acceleration engine optimizes the entire CPU/GPU/DDR process based on game features, greatly improving overall efficiency. In the highest quality performance comparison of "Genshin Impact", the Honor Magic 3 series has a peak temperature 0.5℃ lower than the iPhone 12 Pro, and an average frame rate 5.4fps higher.
In addition, the Magic 3 series is also equipped with superconducting hexagonal graphene material, which has a thermal conductivity 50% higher than ordinary graphene. It has a built-in 4600mAh large battery. Honor Magic3 supports 66W wired fast charging, and Honor Magic3 Pro supports 66W wired and 50W wireless dual fast charging.
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