CanSemi successfully completed the second phase project financing

Recently, Guangzhou CanSemi Semiconductor Technology Co., Ltd. (hereinafter referred to as "CanSemi Semiconductor") officially completed the financing of the second phase of the project. This financing was jointly formed by domestic institutions with deep investment experience in the integrated circuit industry or close upstream and downstream industry and finance cooperation, such as "Guangdong Semiconductor and Integrated Circuit Industry Investment Fund", "SDIC Venture Capital", "Lanpu Venture Capital", "Walden International", "Jifu Venture Capital", "GAC Capital", "Huiyou Investment" and "Agricultural Bank Investment".

The financing will mainly be used for the construction of the second phase of Guangdong Xin Semiconductor's project.

CanSemi is a local independent innovation enterprise in Guangdong Province. It is also the first and only 12-inch wafer manufacturing company in the Guangdong-Hong Kong-Macao Greater Bay Area to enter mass production. It insists on "customized foundry" as its core operating strategy, closely focusing on the core purpose of "obeying the national industrial strategy and obeying Guangdong's industrial layout", "adhering to market orientation and independent innovation", and is committed to meeting the booming domestic chip manufacturing needs.

The first phase of the CanSemi project started in March 2018, was completed and put into production in September 2019, and achieved full production in December 2020. The product yield rate reached more than 97%, which is a relatively high standard in the industry. The second phase of the project will add 20,000 pieces of monthly production capacity, and the technology node will be extended to 55nm process. The equipment is currently being moved in, and it is expected to be put into production in the first quarter of 2022.

As the main carrier of Guangdong Province's major strategic deployment to build China's integrated circuit "third pole", the successful completion of CanSemi's financing this time demonstrates the high recognition of CanSemi's current progress, future plans and development prospects by governments at all levels in provinces, cities and districts, domestic investment and industry circles, as well as new and old investors. It provides sufficient technology, talents, funds, markets, policy support and other resources for the company's subsequent construction and production and operation, and more effectively supports the company's continued healthy leapfrog development.

After this round of financing, Guangdong Xin Semiconductor will further improve its development strategy, strengthen the deep cultivation and integration of resources between upstream and downstream of the industrial chain, focus on key special processes, improve product technology upgrades, and build solid competitive barriers in supporting domestic chip independent innovation, domestic alternative processes and production capacity needs. It is also committed to achieving significant breakthroughs in the industrial and automotive-grade chip markets for high-end analog chips.