On March 8, Hangzhou Dixin Technology Co., Ltd. (hereinafter referred to as "Dixin Technology"), a developer of 5G IoT analog RF chips, announced the completion of a nearly 100 million yuan Series A financing round, led by Yinghua Capital, followed by old shareholders Rockchip Microelectronics and Yanmulao Investment, and Qingtong Capital serving as the exclusive financial advisor.
Founded in 2018, Dixin Technology focuses on the design and development of high-end chips for 5G wireless communication links and low-power, high-performance IoT RF front-end chips, and is committed to becoming a world-leading developer of communication link analog RF chips. Since its establishment, Dixin Technology has completed multiple rounds of financing. In January 2020, Dixin Technology completed its angel round of financing, and in August of the same year, it completed angel+ rounds of financing.
According to the official news of Dixin Technology, the core team members of Dixin Technology have more than 20 years of R&D and mass production experience. They have worked in international first-tier semiconductor companies such as Qualcomm, MediaTek, Samsung, Texas Instruments, Huawei HiSilicon, etc. Their professional fields cover RF chips, analog and mixed signal chips, communication system design, mass production testing and market development, etc. More than 80% of them have a master's degree or above and have complete and leading chip independent R&D capabilities.
As of now, the RF front-end chips mass-produced by Dixin Technology have been applied to the products of dozens of customers including Lumi, Shunzhou Technology, Feibi, Kuaizhu Technology, and Lidaxin.
According to official news from Qingtong Capital, Wu Ruili, co-founder of Dixin Technology, said that in the future, Dixin Technology will be based in the communications industry, focus on the application of high-barrier analog RF chips, and strive to become the top domestic communications chip supplier.
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