Huawei's next-generation flagship chip is Kirin 9010, which will use 3nm process

Recently, the well-known foreign blogger @RODENT950 revealed that Huawei's next-generation processor will be named Kirin 9010 and will adopt advanced 3nm process.

However, this revelation is somewhat ahead of the times and counterintuitive. According to TSMC's plan, 3nm will complete certification and trial production this year, and will be put into large-scale mass production in 2022. The industry has even said that Apple has taken the lead in booking TSMC's initial 3nm production capacity and become TSMC's first batch of 3nm customers. Samsung's plans are basically synchronized with TSMC. Previously, a senior executive of Samsung's wafer foundry department told attendees at an undisclosed event that Samsung will mass-produce 3nm chips in 2022.

According to Digitimes, industry insiders revealed that TSMC FinFET and Samsung GAA have encountered different but critical bottlenecks in the development of 3nm process technology. The report said that TSMC and Samsung will have to postpone the development of 3nm process technology.

This means that 3nm will not be able to be mass-produced until 2022 at the earliest.

In October 2020, Huawei released the Kirin 9000 processor, which is also the world's first 5G mobile phone SoC with a 5nm process. Subsequently, Samsung Exynos 1080 and Qualcomm Snapdragon 888, which also use a 5nm process, were released.