On December 18, the "2020 Chongqing Micro LED Industry Innovation Forum and Konka Semiconductor Display Technology and New Product Launch Conference" was held in Chongqing.
At the meeting, Konka Group and the investment platform of Bishan District of Chongqing jointly initiated the establishment of the Chongqing Konka Semiconductor Industry Equity Investment Fund Project. The fund has a scale of 2 billion yuan and focuses on investment in industries such as semiconductor new materials, semiconductor equipment, chips, IC design, packaging and testing.
In addition, Konka Group has also signed joint venture projects focusing on Micro LED, such as smart wearable product supporting production projects and smart commercial display engineering projects, with relevant partners.
Zhou Bin, president of Konka Group, said: "From 2018 to now, we have completed the overall design and strategic planning of the semiconductor industry, and are working hard to build a full-chain layout from materials and equipment, chip design, to wafer manufacturing, packaging and testing, and then to downstream applications."
In the process of building a comprehensive semiconductor ecosystem, in addition to focusing on the layout and cultivation of the industrial chain, Konka Group continues to enhance its core competitiveness in the display field. Bishan District is the second national high-tech zone in Chongqing. It has a strong industrial foundation and a good innovation ecosystem. It is the strategic focus of Konka Group's layout of the optoelectronic technology industry.
In September 2019, Chongqing Konka Optoelectronics Technology Research Institute, which is positioned as a third-generation and new-generation compound semiconductor development and mass production platform, settled in Bishan, dedicated to Micro LED R&D, design and production. With the continuous growth of R&D investment and the growing professional team, Chongqing Konka Optoelectronics Technology Research Institute has built Micro LED full-process R&D and small-batch production lines, and completed nearly 700 core patent applications.
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