TSMC Wafer Manufacturing Service Alliance Innovation Center was unveiled

On December 3, the Suzhou Integrated Circuit Innovation Center was launched and a signing ceremony for key projects was held. The center aims to gather more than 200 leading integrated circuit companies through 3-5 years of efforts, with an annual additional output value of 3 billion to 5 billion yuan.

At the site, the Semiconductor Industry Alliance, the Integrated Circuit Exhibition Center, the Intellectual Property Operation Center, and the TSMC Wafer Manufacturing Service Alliance Innovation Center were unveiled, and the Suzhou Branch of the National Integrated Circuit Industry-Education Integration Innovation Platform of Nanjing University, the Suzhou Open Source Chip Technology Innovation Institute of Nanjing University, and the China Chip Design Cloud Training Platform were settled. The Innovation Center also signed contracts with settled projects, banks, investment institutions, China Science and Technology ICC, CCID, Jiangsu Telecom and other public service platforms.

In recent years, Suzhou High-tech Zone has prioritized the development of new-generation information technology, especially integrated circuits, as one of the leading industries to optimize the industrial structure and achieve high-quality development. It has issued the "Opinions of Suzhou High-tech Zone on Accelerating the Development of the Integrated Circuit Industry" and established a special fund for industrial development with a total scale of 10 billion yuan. At present, the zone has gathered a large number of leading companies such as Guoxin Technology and Silicon Valley Analog and has formed a flagship product represented by high-end core chips and high-power laser semiconductor chips. It has application companies such as China Mobile Suzhou R&D Center and has built a number of public service platforms based on CESI Laboratory and Sigurd.