The official version of MIUI 12 based on Android 11 has been pushed one after another. Mi fans are already looking forward to the arrival of MIUI 13.
There were previous speculations that Xiaomi might reveal news about MIUI 13 at the Xiaomi Developer Conference at the beginning of the month, but things went against expectations and the official seemed to be keeping it highly confidential. Upon investigation, it was found that Jin Fan, the person in charge of MIUI experience and the publisher of MIUI 12, had not updated his Weibo for a long time, and his seclusion was obvious.
However, Manwex, a super moderator of the Xiaomi community, recently revealed that MIUI 13 will be released in the second quarter of 2021.
In fact, MIUI 12 was officially released in April this year. If the news is true, it will be exactly one year later. Of course, this also means that Xiaomi Mi 11 will miss the chance to be the first to launch MIUI 13. Snapdragon 875 will be released tomorrow night. It is said that Xiaomi Mi 11 will be available at the end of this year at the earliest and January next year at the latest.
Regarding the new MIUI, the few official public discussions have mentioned that the next generation MIUI system will continue to focus on animation adjustments, while evolving the super wallpaper function (allowing users to customize creation), and bringing other new features.
As for the models that support the upgrade, there is private intelligence that Xiaomi 8, Xiaomi MIX 2 and others will not be eligible.
Previous article:Redmi Note 9 4G passes EEC certification, will be launched globally
Next article:Are you still waiting for the iPhone's under-screen fingerprint if you wear a mask?
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Download from the Internet--ARM Getting Started Notes
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Learn ARM development(15)
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- Ground interference problem? (Attached circuit diagram, powered by USB 5V 1A)
- Causes of blistering on PCB copper plating board
- Power supply obstacles + MOSFET switching losses
- IMX6 Linux system compilation manual
- 【Perf-V Evaluation】+ Construction and basic use of development environment (1)
- School has started~ The beasts are back in the cage~~ The sound of reading is so nice~
- The Maximum Stack Usage in the compiled .htm file is 0 bytes
- [National Technology N32 Bluetooth chip development package] --N32WB452 series
- Regarding the use of UCC27531, I just want to ask a small question
- XC3S200A chip loading problem