A billion-yuan project settled in Hefei, and the world's seventh largest semiconductor packaging and testing project landed in Yantai

This week, the second phase of Jinghe Integrated Circuit and Lushow Technology's silicon carbide industrial park projects settled in Hefei, the world's seventh largest semiconductor packaging and testing project settled in Yantai, Horizon Robotics' automotive AI chip global R&D center project landed in Lingang New Area, and iFlytek established a wholly-owned new artificial intelligence subsidiary...

Project News

The 18 billion yuan Jinghe Integrated Phase II and the 10 billion yuan Roshow Technology Silicon Carbide Industrial Park projects settled in Hefei

On September 15, at the 2020 China Semiconductor Materials Innovation and Development Conference, 11 key projects including the second phase project of Hefei Jinghe Integrated Circuit Co., Ltd. and the Luxshare Technology Third Generation Semiconductor (Silicon Carbide) Industrial Park project were signed and settled in Hefei City.

According to Hefei Online, the total investment in the second phase project of Hefei Jinghe Integrated Circuit Co., Ltd. is 18 billion yuan. Cai Huijia, general manager of Hefei Jinghe Integrated Circuit Co., Ltd., introduced that the project signed this time is Jinghe’s second factory. The planned monthly production capacity of Jinghe’s second phase project is 40,000 12-inch wafers. It will mainly engage in mass production of 55-nanometer foundry process and develop 40-nanometer process at the same time.

The world's seventh largest semiconductor packaging and testing project settled in Yantai

According to the Yantai Municipal Government Office, on September 16, Yantai City and the Zhongguancun Rongtin Financial Information Industry Alliance held a strategic docking meeting and a cooperation project signing ceremony. The world's seventh largest semiconductor packaging and testing project and smart technology merger and acquisition fund project settled in Yantai.

It is reported that the high-end semiconductor packaging and testing project signed this time will be wholly acquired by Wisdom Road Capital, the world's seventh largest integrated circuit packaging and testing company and the third largest automotive electronics packaging and testing company, Singapore United Technologies Corporation (UTAC), which will introduce the world's leading automotive-grade and wafer-level packaging technology to Yantai and build a world-class packaging and testing base and R&D center in the Yantai Development Zone.

Horizon Robotics' global R&D center for in-vehicle AI chips is launched in Lingang New Area

On September 16, the Administrative Committee of the Lingang New Area of ​​Shanghai and Horizon (Shanghai) Artificial Intelligence Technology Co., Ltd. officially signed a contract, and the global R&D center project for in-vehicle AI chips with an investment of nearly 3 billion yuan officially moved into the International Innovation Collaborative Zone of the Lingang New Area.

After the signing of the project, the global R&D headquarters of in-vehicle AI chips will be built in the Lingang New Area. The total investment of the project is nearly 3 billion yuan, and it is expected to achieve mass production of one million in-vehicle AI chip smart cars in the next two years.

The Huazhong University of Science and Technology-Huawei Technologies Co., Ltd. New Storage Technology Innovation Center was opened in Wuhan Optics Valley, Hubei

On September 11, the Huazhong University of Science and Technology-Huawei Technologies Co., Ltd. New Storage Technology Innovation Center was opened in Wuhan Optics Valley, Hubei. The Storage Technology Innovation Center is located at Huazhong University of Science and Technology, and its opening will usher in a new stage of cooperation between Huawei and Huazhong University of Science and Technology.

It is understood that Huawei storage products are widely used in massive data processing scenarios such as human genome sequencing and operator call bill processing of tens of millions of people.

The first high-end COF production line in China, Jiangsu Shangda Electronics COF project was put into production

On September 11, the COF project of Shangda Electronics in Pizhou, Jiangsu Province, was put into production. The first high-end COF production line in China officially started production.

江苏上达总经理沈洪表示，江苏上达COF量产线于本月初顺利试产。本次在邳州工厂投入的是业内最先进的COF量产线，能够量产7微米线路的COF产品，预计在10月后制程产能可以达到7.5KK/月，2021年3月全制程产能可以达到15KK/月，2021年年底全制程产能达到30KK/月。

Entreprise's news

Focusing on projects such as the automotive electronics industry, Huawei may deepen cooperation with Hefei

On September 14, Yu Aihua, member of the Standing Committee of the Anhui Provincial Party Committee and Secretary of the Hefei Municipal Party Committee, discussed deepening cooperation with Richard Yu, Executive Director of Huawei and CEO of its consumer business. According to the Hefei Daily, the cooperation between Hefei and Huawei will focus on projects such as the automotive electronics industry, the city brain, and the "one district, one office, and three centers".

Bitmain changes legal representative to Wu Jihan, and adds him as executive director

Qixinbao data shows that Beijing Bitmain Technology Co., Ltd. changed its legal representative to Wu Jihan on September 14. At the same time, Wu Jihan was added as an executive director.

On October 28, Beijing Bitmain Technology Co., Ltd. underwent an industrial and commercial change, with the executive director and legal representative changed from Zhan Ketuan to Wu Jihan, with Zhan Ketuan serving as general manager and Ge Yuesheng as supervisor. The next day, Wu Jihan sent an email to all employees of the company, announcing the removal of Zhan Ketuan from all positions at Bitmain, effective immediately.

In addition, this week, iFLYTEK established a new wholly-owned artificial intelligence subsidiary, Yutaiwei added three new investors, and several companies including Zhouxun Technology and Jiangling Semiconductor completed a new round of financing.

iFLYTEK establishes a new wholly-owned artificial intelligence subsidiary

Qixinbao APP shows that iFLYTEK established a wholly-owned subsidiary, Henan iFLYTEK Artificial Intelligence Technology Co., Ltd. on September 8. The registered capital is RMB 100 million, and the legal representative is Sun Liang.

According to industrial and commercial information data, the business scope of the newly established subsidiary includes intelligent product technology development, technical services, and technical consulting; computer software and hardware technology development; exhibition and display services; data processing and storage services; computer system integration; building intelligent engineering; security technology prevention engineering, etc.

Yuta

Qichacha shows that recently, Suzhou Yutai Microelectronics Co., Ltd. has added three new investors, including: Jiangsu Huoquan Yuanhe Puhua Equity Investment Partnership (Limited Partnership), Suzhou Huiqi Venture Capital Partnership (Limited Partnership) and Suzhou Juyuan Zhuxin Venture Capital Partnership (Limited Partnership).

In October 2019, Yutaiwei received investment from Huawei Haobo, and the investment ratio was not disclosed.

ZX Technology

Recently, 5G RF filter chip design and manufacturing company Zhouxun Technology announced the completion of nearly 100 million yuan in round A financing. This round of financing will mainly be used for the company's 5G SAW/BAW RF filter chip research and development and production base construction.

Jiangling Semiconductor

Recently, Jiangling Semiconductor, an industry-leading domestic developer of semiconductor optical inspection equipment, announced the completion of a tens of millions of yuan Series A financing round. The investors include Shenzhen Hi-Tech Investment, Zhengxuan Investment, and Pengrui Group, and Yunxiu Capital served as the exclusive financial advisor.

Jiangling Semiconductor was established in 2018. The company is mainly engaged in the research and development, manufacturing and sales of semiconductor optical measurement and inspection equipment. Its main products include semiconductor thin film and optical line width measurement machines, semiconductor Micro-Bump three-dimensional inspection machines and semiconductor macro defect inspection machines.