HuaWei Electronics: 8-inch power semiconductor wafer production line project may be put into operation next month

 According to the Securities Times, the first phase of HuaWei Electronics' 8-inch power semiconductor wafer production line project is expected to be put into operation in June 2020. At the same time, the company will make important layouts in the IGBT field to expand the share of IGBT products in white appliances, industrial frequency conversion, UPS and new energy fields.

On March 31, 2019, HuaWei Electronics announced that it would raise 1 billion yuan through a rights issue to build a new power electronic device base project. After the project is completed, HuaWei Electronics will have the processing capacity to process 240,000 8-inch chips per year.

It is reported that HuaWei Electronics mainly produces power semiconductor devices and ICs, which are used in consumer electronics, energy-saving lighting, computers, PCs, automotive electronics, communications protection and industrial control. It has formed a series of power semiconductor products such as IGBT, MOSFET, VDMOS, FRED, SBD, BJT, IPM, etc.

According to official information from HuaWei Electronics in May, HuaWei Electronics currently has multiple 4-inch, 5-inch and 6-inch power semiconductor discrete device and IC chip production lines, with a chip processing capacity of more than 4 million pieces per year, packaging resources of 2.4 billion pieces per year, and modules of 18 million pieces per year. At the same time, HuaWei Electronics' 8-inch production line will be put into operation in June this year.