The packaging and testing capacity can reach 20KK/month. Konka's 2 billion yuan storage chip packaging and testing project will be completed in June

According to the Yanfu Dazhong Daily, the memory chip packaging and testing project invested by Konka Group with 2 billion yuan has been built to the third floor. The main structure will be completed in June and is expected to be put into production before the end of the year.

In addition, the person in charge of the project construction in Yancheng High-tech Zone said that after the project is completed and put into production, it can achieve annual sales of 4 billion yuan, the packaging and testing capacity can reach 20KK/month, and the production yield can reach more than 99.95%, becoming an important advanced manufacturing base on the eastern coast.

The Konka Group storage chip packaging and testing project is invested and constructed by Konka Group Co., Ltd. with a total investment of 2 billion yuan. It is mainly engaged in the packaging, testing and sales of storage chips. After completion, it can achieve annual sales of 4 billion yuan and tax revenue of 100 million yuan.

The project started on March 18. According to the report of Yandu District Media Center at that time, Zhou Bin, president of Konka Group, said that after completion, the project will become the only unmanned factory in China open to third parties, and will serve as a benchmark demonstration for Yancheng to build a high-tech industrial cluster for semiconductors.

On November 25, 2019, Shenzhen Konka announced that due to business development needs, Konka Group plans to invest in the construction of a memory chip packaging and testing plant with Konka Xinying Semiconductor Technology (Shenzhen) Co., Ltd., a holding subsidiary of the company, as the main body. According to the disclosure at the time, the operating entity of the memory chip packaging and testing project is Konka Xinying, located in the Intelligent Terminal Industrial Park of Yancheng City, with a total planned investment of 1.082 billion yuan, of which about 500 million yuan will be invested in the purchase of equipment, etc., to invest in the construction of a memory chip packaging and testing plant, to carry out packaging, testing and sales of memory chips, and to plan trial production by the end of 2020.