Sanan Optoelectronics supplies MiniLED chips to Samsung in batches

SMIC Tianjin Company applied to import the world's largest single-unit 8-inch production line; SMIC signed a listing guidance agreement; BAIC-Imagination and other joint ventures established an automotive chip design company Coreda; Sanan Optoelectronics MiniLED chips were supplied to Samsung in batches; Huaxing Optoelectronics T4 factory will reach full production in the second half of next year...

Project News

SMIC Tianjin Company applied to import the world's largest single-unit 8-inch production line

According to Tianjin Customs, Semiconductor Manufacturing International Corporation (Tianjin) recently declared to Tianjin Customs the import of the world's largest single-unit 8-inch integrated circuit production line. After it goes into production, the company's monthly production capacity can reach 150,000 wafers.

On October 18, 2016, SMIC officially launched the SMIC Tianjin capacity expansion project, with an estimated investment of US$1.5 billion. According to the Xiqing District Government Office, the T1B main production plant, the largest building in the second phase of the SMIC Tianjin Integrated Circuit Production Line Project, an important part of the 2018 SMIC Tianjin capacity expansion project, was officially capped.

Sanan Optoelectronics supplies MiniLED chips to Samsung in batches

On May 7, Sanan Optoelectronics stated in response to investors' questions that the company is currently supplying MiniLED chips in batches to Samsung, and some other customers are in the process of verification and some are supplying in small quantities.

In February 2018, Sanan Optoelectronics and Samsung Electronics signed an Advance Payment Agreement. It is reported that Xiamen Sanan and Samsung Electronics will continue to discuss strategic cooperation on MicroLED. When Xiamen Sanan reaches large-scale mass production capacity, Samsung Electronics will consider Xiamen Sanan as the primary supplier and negotiate a supply agreement acceptable to both parties.

The Ministry of Industry and Information Technology approved the establishment of the National Integrated Circuit Characteristic Process and Packaging Test Innovation Center

According to the official website of the Ministry of Industry and Information Technology, the Ministry of Industry and Information Technology recently approved the establishment of the National High-Performance Medical Device Innovation Center and the National Integrated Circuit Characteristic Process and Packaging Testing Innovation Center.

Among them, the National Integrated Circuit Characteristic Process and Packaging and Testing Innovation Center was established based on Jiangsu Huajin Semiconductor Packaging Research Center Co., Ltd., and its shareholders include key enterprises and research institutes in the field of integrated circuit packaging and testing and materials, such as Changdian Technology, Tongfu Microelectronics, Tianshui Huatian, Shenzhen South Circuit, Suzhou Jingfang and the Institute of Microelectronics of the Chinese Academy of Sciences.

Huaxing Optoelectronics' T4 factory will reach full production in the second half of next year

According to the latest news from Wuhan Free Trade Zone, in the first quarter of this year, the first phase of the Huaxing Optoelectronics T4 project entered the capacity ramp-up stage. The second and third phases of the T4 project are being carried out in full swing and have entered the plant decoration stage. The main equipment for the second phase project is expected to arrive at the factory for installation in July, and the equipment for the third phase project will be delivered and installed by the end of the year. Wuhan Huaxing T4 factory will reach full production in the second half of next year.

CanSemi Phase II: Equipment debugging will begin before the end of the year, and production will begin as early as the first half of next year

According to Nan Fang Daily, Dr. Li Haiming, Vice President of Marketing and Sales of CanSemi, said that by the end of this year, the second phase of the project with an investment of 6.5 billion yuan will enter equipment commissioning and strive to achieve mass production in the first half of next year. We hope to replace imports faster and meet global supply needs.

The second phase expansion project of Guangdong Xin Semiconductor was signed on February 28. The second phase construction of Guangdong Xin Semiconductor will add an investment of 6.5 billion yuan, focusing on the 65-90nm analog process platform, and producing high-precision digital-to-analog conversion chips, high-end power management chips, optical sensors, automotive and biosensor chips and other products.

Kunpeng processors and Haiguang processors help build a local industrial ecosystem

On April 29, the unveiling ceremony of the Chongqing Center of Kunpeng Computing Industry Ecosystem was held. ChinaSoft International, Huawei Software Technology Co., Ltd., and Chongqing Xiyong Comprehensive Bonded Zone Management Committee signed a strategic cooperation agreement to build the "Chongqing Center of Kunpeng Computing Industry Ecosystem". The Chongqing Center of Kunpeng Computing Industry Ecosystem will build a full-stack Kunpeng IT infrastructure and industry applications with Huawei Kunpeng processors as the core, cultivate and develop upstream and downstream enterprises in the Kunpeng computing industry, and build Chongqing into a highland of China's computing industry.

On May 4, the main structure of all buildings of the Chengdu Supercomputing Center was completed and entered the exterior wall construction stage. According to Sichuan Observer, the project is expected to be officially completed in the second half of the year. After completion, the project will fill the gap in the layout of my country's supercomputing center system in the western region.

Previously, Li Jun, president of Sugon Information Industry Co., Ltd., said that the Chengdu Supercomputing Center will be equipped with my country's independently developed chips and adopt the Haiguang processor designed in Chengdu to build a world-class supercomputer and supercomputing center, becoming an important IT infrastructure to serve and support scientific research, commercial simulation and computing, meteorology, big data, artificial intelligence and other industries.

A nitrogen generator built by Linde Gas for Jetta Semiconductor was successfully started up in Shanghai

Recently, Linde Gas announced that a nitrogen generator it built for Jetta Semiconductor was successfully started up in Shanghai. The first of two high-purity nitrogen generators planned to be built is currently in operation, and the second is expected to be put into operation in 2022.

The total investment in the construction project of Jita's special process production line is 35.9 billion yuan. On March 30, 2020, Jita Semiconductor's special process production line was officially put into production.

Taicang and Nantong respectively welcomed the Bitong Semiconductor Equipment Project and the Semiconductor Optoelectronics Industry Chain Park Project

On April 29, Shanghai Bitong Semiconductor Energy Technology Co., Ltd. (hereinafter referred to as "Bitong Semiconductor") signed a semiconductor equipment project investment agreement with the High-tech Zone of Taicang City, Jiangsu Province. Bitong Semiconductor has a total investment of 1 billion yuan, mainly for the advanced process and equipment R&D and manufacturing base of 12-inch nano-scale ion chemical vapor deposition PECVD and 8-inch micron-scale reactive ion physical sputtering deposition RiD, focusing on the development and development of high-end equipment manufacturing in the semiconductor integrated circuit industry.

On April 30, the Semiconductor Optoelectronics Industry Chain Park project invested and established by Suzhou Nachuan Investment Management Co., Ltd. was signed and settled in Nantong High-tech Zone. The total investment of the project is 3 billion yuan, and it is planned to attract about 40 high-tech enterprises, strive to introduce and independently cultivate 2 to 3 listed companies, and the output value is expected to exceed 5 billion yuan after reaching full production.

Construction started in Chuxiong , Yunnan and Hefei, Anhui

On April 29, the semiconductor material project of Chuxiong Chuanzhi Electronic Materials Co., Ltd. started construction in Chuxiong High-tech Zone, Yunnan. The project covers an area of ​​about 33 acres, with a planned total investment of 100 million yuan. It mainly builds production lines with an annual output of 40 tons of high-purity phosphorus, 60 tons of high-purity indium, and 5 tons of high-purity gallium. According to the Chuxiong High-tech Industrial Development Zone, after the completion of the project, it will fill the gap in similar high-end products in China and break the situation of dependence on imports of high-purity phosphorus and other materials.

On May 8, the fifth batch of Anhui Province's implementation of the "Six Stability" and the Hefei Economic Development Zone's major project, the Airport International Town, was held in the Hefei Airport Economic Demonstration Zone. The concentrated start-up projects include 55 strategic emerging industry projects such as the Donghua Software Headquarters Base, NIO China Headquarters, and Huadong Technology Memory Packaging and Testing, with a total investment of 77.5 billion yuan.

Entreprise's news

SMIC Signs Listing Guidance Agreement

According to the official website of the Shanghai Securities Regulatory Bureau, on May 6, SMIC signed a listing guidance agreement, with Haitong Securities and CICC as the sponsors and guidance institutions.

On May 5, SMIC announced that on April 30, the company's board of directors passed a resolution approving the proposal to issue RMB shares, grant special authorization and related matters. After the approval of the special general meeting of shareholders and necessary regulatory approvals, the company will apply to the Shanghai Stock Exchange for the issuance of RMB shares.