On May 8, Redmi officially announced its new phone, the Redmi K30 5G Extreme Edition. One of its biggest highlights is that it is the first to launch the Snapdragon 768G processor, which Qualcomm has not yet officially announced.
Currently, Qualcomm's 7 series 5G chip only has one, the Snapdragon 765G, which is equipped with two A76 large cores with frequencies of 2.4GHz and 2.2GHz respectively, and six 1.8GHz A55 small cores. The GPU is the 625MHz Adreno 620.
Judging from the name, Snapdragon 768G is an upgraded version of Snapdragon 765G, which should be similar to the relationship between Snapdragon 830 and Snapdragon 835.
Subsequently, a whistleblower exposed the detailed parameters of Snapdragon 768G on Twitter, further revealing the upgrade extent of Snapdragon 768G.
Specifically, the main frequency of the two A76 large cores of the Snapdragon 768G have been increased to 2.8GHz and 2.4GHz respectively. The small core remains unchanged, and the GPU main frequency is increased to 750MHz. The large cores and GPU have been fully upgraded.
The whistleblower said that the overall performance of Snapdragon 768G has improved by about 10%, and the prototype machine has scored 360,000 points.
Previous article：MIUI 12 development version: supports 32 models
Next article：Domestic chips achieve breakthrough: Zhaoxin x86 CPU notebook computer is launched
- Popular Resources
- Popular amplifiers
Qualcomm Snapdragon Flight Drone Platform
Qualcomm chip list 7X, 8X, etc.
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claimsAccording to foreign media reports, recently, the British consumer rights organization "Which?" filed an antitrust lawsuit against Apple on behalf of approximately 40 million iCloud users, accusing Apple of violating competition laws and seeking up to $30 million in damages. ...
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thickerOn November 11, sources Jukanlosreve and yeux1122 revealed that both Apple and Samsung's ultra-thin high-density battery projects had failed. The two companies had previously tried to develop ultra-thin high-density batteries in their iPhones. ...
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable developmentAt this year's CIIE, Micron shared the latest progress of the Xi'an packaging and testing plant expansion project, and shared with relevant partners on the theme of "Talking about Empowerment: Co-promoting Coexistence of Business and Sustainable Development"....
- Qorvo: Innovative technologies lead the next generation of mobile industryAt the 12th China Hard Technology Industry Chain Innovation Trend Summit held recently, Qorvo China Senior Sales Director Jiang Xiong shared Qorvo's technological innovation and market development in the new generation of 5G applications. ...
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screenBOE (BOE Oriental) exclusively supplies Nubia and Red Magic flagship new products. The new generation of under-screen display technology leads the industry into the era of true full-screen. On November 5, BOE (BOE Oriental) joined hands with Nubia, ...
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Power Inverter - A critical safety system for electric vehicles
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
- Brief Analysis of Automotive Ethernet Test Content and Test Methods
- How haptic technology can enhance driving safety
- Main steps when configuring the EMIFA module using CSL
- Hi guys!
- ST MEMS Creative Competition Post 4 - Robotic Arm Control
- Detailed explanation of the national standard GB/T 17626 for EMC testing
- Allwinner V853 Modify UART pins and UART ports in Tina Linux (2)
- Bluetooth 5 standard
- 【Home Treasure】 esp32s2 lvgl running clock display
- 【TouchGFX Design】Use TouchGFX to develop STM32 interface software installation and Hello World
- Here is a 555 timer simulation, the output is adjustable duty cycle (less than 50%), the previous simulation, but this simulation is wrong...
- Code efficiency in TMS320F28377S Flash and RAM
京公网安备 11010802033920号