TSMC orders another batch of equipment worth 3.4 billion yuan from ASML

Publisher:huanhuiLatest update time:2019-06-30 Source: 爱集微Keywords:TSMC Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

On the evening of June 24, TSMC issued an announcement stating that it had spent NT$15.279 billion (approximately RMB 3.4 billion) to order a batch of machinery and equipment from ASML Taiwan branch.


        The announcement shows that the delivery or payment terms are 90% of the payment by wire transfer 30 days after shipment and 10% of the payment by wire transfer 30 days after acceptance. The type and quantity of equipment ordered were not specified.


       TSMC's global president Wei Zhejia recently said that TSMC can currently produce 12 million 12-inch wafers and 11 million 8-inch wafers each year, increasing its production capacity by 14.3% annually. This year, it will still invest US$10 billion to expand its production capacity.


       According to the latest report from SEMI, the global semiconductor equipment shipments in the first quarter of this year were US$13.79 billion, a quarterly decrease of 8% and a decrease of 19% compared with the same period last year. However, the semiconductor equipment market in Taiwan is still hot, with sales in the first quarter reaching US$3.81 billion, a quarterly increase of 36% and a surge of 68% compared with the same period last year, making it the market with the largest growth in the first quarter, and the global ranking has also jumped from the second place in the fourth quarter of last year to the world's largest semiconductor equipment market.


Keywords:TSMC Reference address:TSMC orders another batch of equipment worth 3.4 billion yuan from ASML

Previous article:Don't upgrade the iOS 13 public beta! There are many bugs, APP crashes, and poor experience!
Next article:Laptop manufacturers seek breakthroughs: boldly adopt smartphone-inspired designs

Recommended ReadingLatest update time:2024-11-16 13:53

TSMC N3E process, AMD Zen 6 architecture chips are exposed to be mass-produced as early as 2025
On July 5, the source Moore's Law Is Dead revealed that AMD will release Zen 6 architecture chips in the second quarter of 2025, using TSMC's N3E process. Mass production will start before the end of 2025 at the earliest, but the possibility of postponement to 2026 is not ruled out. Sources said in April this y
[Semiconductor design/manufacturing]
TSMC N3E process, AMD Zen 6 architecture chips are exposed to be mass-produced as early as 2025
TSMC leads the way in 7nm process, betting on two major technologies in the future
TSMC (2330-TW), the leading foundry company, uploaded its annual report today (17). In a report to shareholders, Chairman Liu Deyin and President Wei Zhejia pointed out that in the face of operational headwinds such as economic weakness and international trade tensions this year, the company will strengthen its busine
[Semiconductor design/manufacturing]
Qualcomm Snapdragon 8 Plus exposed: TSMC's 4nm process Android's most powerful chip
      This afternoon, blogger @数码闲聊站 broke the news that Xiaomi is polishing Qualcomm SM8475, which is Qualcomm's flagship processor to be commercialized in the second half of the year. It is named Snapdragon 8 Plus, which is a slightly upgraded version of Snapdragon 8.   Compared with Snapdragon 8, the biggest upgrad
[Mobile phone portable]
Qualcomm Snapdragon 8 Plus exposed: TSMC's 4nm process Android's most powerful chip
Executives disclosed that TSMC has taken the leading share of EUV and the 2nm wafer factory will be built in Hsinchu
During TSMC's 2021 online technical seminar, Senior Vice President of Operations YP Chin disclosed important progress related to the company's chip manufacturing capabilities. It is reported that TSMC currently owns nearly half of the world's extreme ultraviolet lithography (EUV) machines and undertakes more than half
[Semiconductor design/manufacturing]
Executives disclosed that TSMC has taken the leading share of EUV and the 2nm wafer factory will be built in Hsinchu
Intel chip orders are delayed, and it is reported that Apple will cover all TSMC’s 3nm production capacity during the year
News on August 29, according to the latest report from DigiTimes: TSMC is unlikely to see a significant increase in 3nm chip orders before 2024. According to sources, due to delays in Intel's shipments, Apple will contract all TSMC's 3nm production capacity this year for the upcoming iPhone, Mac and iPad. On the iPhon
[Semiconductor design/manufacturing]
Intel chip orders are delayed, and it is reported that Apple will cover all TSMC’s 3nm production capacity during the year
TSMC Bulk CMOS Technology Assistant Movandi Realizes CMOS Phased Array Radar
Movandi announced that it has implemented a PAAM (Phase-Array Antenna Module) design with more than 300 antennas using TSMC CMOS technology, which can provide breakthrough performance and the scale and cost-effectiveness of Bulk CMOS. Movandi's phased array solution provides an ideal combination of output power, cos
[Network Communication]
The epidemic in Taiwan, China continues to heat up! An engineer at TSMC was diagnosed
According to Juheng.com, relevant departments in Taiwan announced today (22) that an engineer at TSMC was diagnosed with COVID-19. TSMC said it has stepped up disinfection of the employee's work area and public areas, and the incident will not affect the company's operations. It is reported that the engineer had con
[Mobile phone portable]
In the tug-of-war over "chip shortage", TSMC may expand 28nm production capacity in two locations
In this tug-of-war over the chip shortage, 28nm capacity is the most in-demand capacity. After UMC announced the expansion of 28nm capacity in Southern Taiwan Science Park, TSMC's Nanjing plant expansion project for 28nm was also approved a few days ago. It is reported that the latter also plans to expand 28nm capacit
[Mobile phone portable]
Latest Mobile phone portable Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号