Xin'en's latest situation: the team has more than 330 people, more than 80 equipments have been ordered, and three production lines have been built

According to Qingdao Xinwang, as of May 2019, Qingdao Xinen Project Management and Technical Team has signed 330 management and technical personnel, including more than 20 doctors and more than 60 masters. The raft foundation construction of the 8-inch plant of the project is 90% complete; the raft foundation construction of the 12-inch plant is 93% complete; the first floor structure of Test Building 1 is 90% complete; the fourth floor structure of Test Building 2 is 90% complete; and the third floor structure of the administrative center is 60% complete. 87 second-hand production equipment have been ordered, of which 60 have been renovated.

In March this year, Zhang Rujing said that the Xin'en project was progressing smoothly.

      The Xin'en (Qingdao) Integrated Circuit Project is located in Qingdao International Economic Cooperation Zone. It is the first CIDM integrated circuit project in China and was signed in Qingdao West Coast New Area in March 2018. Xin'en Integrated Circuit Company is also Zhang Rujing's fifth venture. Known as the "Father of Chinese Semiconductors", he chose to develop a CIDM model suitable for the development of China's semiconductor industry in Qingdao, that is, to create a shared integrated component manufacturing company that integrates chip design, chip process technology research and development, chip manufacturing, chip packaging and testing, and provides high-quality and efficient products to end customers in an integrated manner.

It is reported that the total investment of the first and second phases of the project is about 18.8 billion yuan, of which the total investment of the first phase is about 8.1 billion yuan. It covers an area of ​​about 373 acres and a total construction area of ​​about 350,000 square meters. It is mainly engaged in the mass production of integrated circuit products such as 12-inch chips, 8-inch chips, and photomasks. After full production, it can achieve an average annual output value of about 4.61 billion yuan and a net profit of about 970 million yuan.

At present, the Xin'en (Qingdao) integrated circuit project has determined the technical route of special power chips and high-end microcontrollers. The 12-inch plant has been planned to start with 40-nanometer logic products and gradually advance to 28-nanometer product lines. Through the development of front-end process immersion lithography, self-aligned metal silicide, and embedded SiGe source and drain process; back-end process ultra-low dielectric material interlayer dielectric layer process integration, and 28-nanometer high dielectric layer metal gate level, the device performance is confirmed.

Xinwang reported that the project will develop 12-inch 40nm-28nm integrated circuit chip product process technology. In addition to the 40nm standard logic process authorized by STMicroelectronics, it will also develop cutting-edge processes for embedded flash memory to produce microprocessor MCU chips. It will also develop 8-inch 180nm-110nm integrated circuit chip product process technology, including digital analog hybrid (BCD, DLP), high-end IGBT and other semiconductor power devices. Among them, the high-end and ultra-thin (less than 50 micron silicon wafer thickness) process technology of the reverse-conducting IGBT of IGBT is the first in China. RC-IGBT is composed of alternating IGBT units and FWD units.

Zhang Rujing also revealed in March this year that some of Xin'en's current talents have rich experience in 14nm process mass production, and they are preparing for Xin'en's advanced process mass production. The company's second phase project is aimed at 14nm and below advanced processes, and it is planned to build two Fabs with a monthly production capacity of 50,000 pieces.

Xinwang's report pointed out that the Xin'en (Qingdao) integrated circuit project is building an 8-inch integrated circuit production line with a special process, a 40-nanometer 12-inch integrated circuit production line with the most advanced domestic digital-analog hybrid process, a domestic most advanced 14-nanometer photomask production line, a chip testing plant, and forming an embedded chip 32-bit MCU integrated circuit design team.