TSMC's second-generation 7nm+ process has been mass-produced with the addition of EVU extreme ultraviolet lithography for the first time

TSMC officially announced that it has started mass production of the 7nm N7+ process. This is the first time for TSMC and the industry to mass produce EUV extreme ultraviolet lithography technology. It is of great significance and is a big step ahead of Intel and Samsung.

        TSMC said that the yield rate of the 7nm+ EVU process has been improved to the same level as the first-generation 7nm, which will lead to a significant increase in the production capacity of 7nm process chips this year.

        TSMC estimates that its total production capacity in 2019 will reach 12 million 300mm wafers, of which 1 million will be 7nm process, a sharp increase of 150% over last year.

        According to previous news, Huawei's Kirin 985 will be the first to use TSMC's 7nm+ EUV process and is expected to be used in the Mate 30 series. Despite the US restrictions, TSMC has made it clear that it will not stop supplying Huawei, at least for now.

        In addition, Apple's A13 has also been locked on TSMC's 7nm+, and this year's new iPhone will rely on it.

TSMC also revealed that it is steadily advancing the next-generation 5nm process and fully applying EUV technology. It has begun risk trial production and is expected to start mass production in the first quarter of 2020.

        Fab 18, a new factory located in the Southern Taiwan Science Park, has already started equipment relocation and installation. It will directly start 5nm when it goes into production next year and prepare for the future 3nm process.

        In addition, TSMC also has a transitional 6nm process, which is improved based on the 7nm process. It is expected to start trial production in the first quarter of 2020 and is very suitable for direct upgrades for existing 7nm process users.