In order to build a third-generation semiconductor highland, Shenzhen Pingshan will deliver the "red envelope package"

Pingshan District of Shenzhen City has issued the application guidelines for the 2019 Economic Development Special Fund Integrated Circuit Third Generation Semiconductor Special Fund.

According to the application guidelines, the scope of financial support covers loan financing, housing use, settlement incentives and other aspects.

Special funding for credit financing support

For loans with a term of more than one year obtained by enterprises from financial institutions, a 50% interest subsidy will be provided based on the People's Bank of China's benchmark interest rate for the same period on the day the loan is actually issued. The interest subsidy support for the same financing project shall not exceed three years, and the maximum annual interest subsidy support for each enterprise is 2 million yuan.

For credit financing of more than one year obtained by enterprises through third-party financing guarantee institutions, a 50% subsidy will be provided based on the financing guarantee fee paid by the enterprise to the guarantee institution. The same guarantee project will be supported continuously for no more than three years, and the maximum annual subsidy for each enterprise is 2 million yuan.

Special funding for housing support

For integrated circuit enterprises that meet the funding conditions of the "Implementation Rules for the Management of Innovative Industrial Houses in Pingshan District, Shenzhen", the weight coefficient of the industry category in the rental subsidy standard is 50% (i.e. A is 50%), and the subsidy amount is 50%-90% of the market assessment price of industrial houses of the same grade in the same area. For three consecutive years, the annual subsidy for each enterprise is up to 5 million yuan, and it does not exceed the total tax paid by the enterprise in Pingshan District in the previous year.

Special funding for design, equipment and materials companies to settle down

For newly established or newly relocated integrated circuit enterprises in the design, equipment and materials categories, if the paid-in capital in the first year or the first fiscal year after establishment or relocation exceeds RMB 20 million, for newly established enterprises, a subsidy of up to RMB 5 million will be provided to each enterprise based on 10% of the paid-in capital in the first year or the first fiscal year after establishment; for newly relocated enterprises, a subsidy of up to RMB 5 million will be provided to each enterprise based on 10% of the additional paid-in capital in the first year or the first fiscal year after relocation.

Special funding for manufacturing and packaging and testing companies to settle down

For newly established or newly relocated manufacturing, packaging and testing integrated circuit enterprises, if the actual industrial investment in the first year or the first fiscal year is RMB 50 million or more (inclusive), each enterprise will be given a subsidy of up to RMB 10 million based on 10% of the actual industrial investment amount completed by the enterprise in that year.

Special funding to support core technology and product development

Support enterprises to carry out technical research and development and product research and development of high-end general-purpose integrated circuit devices (CPU, GPU, memory, etc.), third-generation semiconductor devices (power semiconductor devices, etc.), key equipment (photolithography machines, etc., ion implantation machines, vapor deposition equipment, etc.), core materials (third-generation semiconductor materials, target materials, photoresists, photosensitive adhesives, etc.), advanced processes (stacked packaging, etc.), etc., and provide each enterprise with an annual grant of up to 5 million yuan, based on 10% of its R&D investment.

Special funding to support joint project R&D

Support upstream and downstream enterprises in Pingshan District to cooperate in R&D. If the project is completed and put into mass production with an annual output value or annual operating income of more than 10 million yuan, a subsidy of up to 6 million yuan will be provided based on 10% of the joint investment amount of the enterprise. The above-mentioned subsidy shall be jointly applied for by the enterprises.

Special funding to support military-industrial cooperation and the construction of overseas R&D centers

If an enterprise undertakes a military scientific research project and obtains funding from relevant municipal policies, it will be given matching funding of up to 5 million yuan in a 1:1 ratio with the actual municipal funding amount.

Support enterprises to set up R&D centers overseas through new establishment or mergers and acquisitions, absorb local R&D talent and resources, and provide supporting subsidies of up to 5 million yuan in a 1:1 ratio with the actual funding amount at the municipal level.

Special funding to support public service platforms

For public service platforms built by enterprises, if approved by the district government, a one-time subsidy of up to 20 million yuan will be given, accounting for 50% of the purchase costs of EDA, IP, testing and verification equipment, etc.

For those who receive relevant funding at the municipal level, matching funding will be provided at a 1:1 ratio to the actual funding amount at the municipal level.

Special funding to support the purchase and use of EDA software

For enterprises that purchase EDA design tool software (including software upgrade costs), purchase integrated circuit design services from the public service platform in the jurisdiction, or use EDA design tool software through the public service platform, an annual subsidy of up to RMB 2 million, RMB 1 million, and RMB 500,000 will be provided to each enterprise based on 50% of the actual expenses incurred.

Special funding to support IP purchase and reuse

For enterprises that purchase IP to carry out high-end chip research and development, a subsidy of 50% of the actual payment for the IP purchase will be provided, with a maximum annual subsidy of 3 million yuan per enterprise.

For enterprises that use IP reuse services provided by third-party integrated circuit design public service platforms, an annual subsidy of up to 2 million yuan will be provided to each enterprise, based on 50% of the actual expenses incurred.

Support special funding for testing and verification

For enterprises that carry out reliability, compatibility testing and verification, failure analysis and certification of engineering pieces, equipment and materials, an annual subsidy of up to 2 million yuan will be provided to each enterprise, which is 50% of the actual expenses incurred.

Support tape-out special funding

For integrated circuit design companies participating in the MPW project, an annual subsidy of up to RMB 2 million will be provided to each company, which is 80% of the direct costs of the MPW (for universities or research institutes participating in the MPW project, 90% of the direct costs of the MPW).

For enterprises in Pingshan District that carry out MPW, each enterprise will be given an annual subsidy of up to RMB 4 million according to the above ratio.

Subsidy will be provided to integrated circuit design companies for their first engineering tape-out, accounting for 30% of the first engineering tape-out costs (including IP authorization or purchase, mask production, tape-out, etc.), with an annual subsidy of up to RMB 3 million per company.

For enterprises in Pingshan District that use integrated circuit production lines for tape-out, each enterprise will be given an annual subsidy of up to RMB 6 million, based on 60% of the initial tape-out costs.

Support special subsidies for first purchase and first use

Pingshan District’s integrated circuit manufacturers that purchase and use chips independently developed by Pingshan District’s integrated circuit design companies for the first time will be given a subsidy of up to 500,000 yuan, 10% of the purchase amount. The above subsidy is jointly applied for by the integrated circuit manufacturers and the design companies.

Support enterprises to purchase and use for the first time the equipment and materials independently developed and produced by integrated circuit enterprises in Pingshan District, and provide a subsidy of up to 1 million yuan at 10% of the purchase amount.

For enterprises that receive insurance compensation funding from the state for their first major technological equipment, matching funding will be provided at 50% of the actual state funding amount.

Special funding for productive electricity use support

For the electricity costs of integrated circuit manufacturing enterprises, a 50% subsidy will be provided on a "pay first, then reimburse" basis, with a maximum annual subsidy of 5 million yuan per enterprise.

We support enterprises in building double-circuit, energy storage power stations and other power facilities. After they are completed and put into use, we will provide a one-time subsidy of up to 5 million yuan, which is 30% of the actual investment costs of the enterprise.

Special Funding for Environmental Protection Facilities Support

For enterprises that build environmental protection treatment facilities or projects for waste gas, waste water, solid waste, etc., each enterprise will be given an annual subsidy of up to 5 million yuan, which is 50% of the cost of the corresponding facilities or projects.

For the daily environmental protection expenses paid by enterprises, each enterprise will be given an annual subsidy of up to 1 million yuan, based on 50% of the actual expenditure.