NXP’s WLAN7207H front-end module combines outstanding Wi-Fi 6 and Bluetooth performance with product design features to enable high-performance smartphones
Shanghai, China – July 12, 2022 – NXP Semiconductors NV (NXP) has introduced the WLAN7207H 2.4 GHz front-end integrated circuit (FEIC) to enable Wi-Fi 6 connectivity in the Honor flagship Magic V smartphone. The NXP WLAN7207x single-channel FEM series provides design flexibility for mobile phone routing and printed circuit boards (PCBs), optimizing the RF performance of smartphones.
Product Importance
To meet consumer needs, smartphones are becoming more and more complex, making architecture and PCB design more and more challenging. At the same time, consumers do not want to sacrifice Bluetooth and Wi-Fi 6 performance. With the update and iteration of technology, the performance of Bluetooth and Wi-Fi 6 continues to improve, such as reduced latency, improved network capacity and efficiency. The WLAN7207x single FEM series gives mobile phone routing and PCB layout more design freedom, which can achieve RF optimization, thereby improving Wi-Fi 6 and Bluetooth performance.
More details
“Consumers are increasingly relying on their smartphones to get the benefits of more data, and Wi-Fi 6 can deliver on that demand by moving rapidly growing amounts of data across more devices, ” said Doeco Terpstra, vice president and general manager of the Smart Antenna Solutions product line at NXP. “Our FEIC solution delivers the Wi-Fi 6 performance benefits that consumers demand without sacrificing design flexibility for OEMs.”
“As smartphones become more and more feature-rich, consumers are paying more and more attention to the appearance of their devices,” said Zhao Ming, CEO of Honor. “NXP’s FEM solution not only helps us overcome the increasing complexity and challenges in the design of flagship phones, but also improves the transmission range of Wi-Fi 6 and optimizes signal quality to provide consumers with better performance.”
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