Welding Robot Summit Partner Company Style ⑩: Microvision Sensing MEMS 3D Depth Camera

Wuxi Weishi Sensing Technology Co., Ltd. (hereinafter referred to as "Weishi Sensing") was established in July 2019. With MEMS chip technology as its core, it has full-stack technical strength in MEMS micromirror chips, driver ICs, 3D imaging algorithms and system integration. It is one of the very few 3D sensing hardware suppliers in the industry that masters core chip technology.

The founding team of Microvision Sensing began conducting MEMS chip-related research in 2008, and began to focus on the technical research of MEMS micromirror chips and their application modules, products and solutions in 2013.

Microvision Sensor has four core technologies:

The Microvision Sensing team has more than 15 years of experience in MEMS mass production, and has therefore accumulated a wealth of MEMS production-related resources. When production was most intense in 2020, Microvision Sensing was still able to maintain a very good and stable cooperative relationship with three MEMS foundries. Without relying on any government or shareholder resources, the shipment of MEMS chips in 2020 still exceeded 10 million.

Today, Microshi Sensing has mass-produced coded structured light 3D depth cameras and lidar products. Its product line covers multiple fields such as depalletizing and stacking, loading and unloading, logistics sorting, welding and polishing, medical beauty, and agricultural monitoring.

From the specific product line of Microvision Sensing, MEMS micromirror chips include three series of products: 1. MEMS micromirror series for 3D cameras (scanning state): VS-LSA140D, VS-LSA280D, VS-EM1A, VS-EM2D; 2. MEMS micromirror series for LiDAR (mixed state): CDA100D; 3. MEMS micromirror series for optical communication (steady state): VS-VOACW1A, VS-SWTCW1B.

Microvision's MEMS coded structured light projection module has two products: MSC-LO660 and MSC-PO8508.

The MEMS red light coded weld tracking line projection module (MSC-LO660) uses a one-dimensional MEMS micromirror as a scanning mechanism and a built-in optical feedback system, which can flexibly control the projection of the laser scanning range and laser line graphics. Users can configure it according to product requirements. The product is mainly used in industrial weld tracking welding systems, machine vision and other fields. In the weld tracking welding system, it can effectively solve the positioning interference problem of the internal fillet groove of high-reflective metals.

The MEMS infrared 3D coded surface structured light projection module (MSC-PO8508) uses the independently developed 1D MEMS galvanometer chip as the scanning mechanism, with a built-in angle feedback system, which can realize high-precision one-dimensional surface structured light projection in multiple modes, and is mainly used in the field of structured light 3D cameras. The device is small in size, large in depth of field, low in cost, and simple to operate. It can realize one-dimensional programmable surface structured light graphics projection and meet the needs of Gray code and phase shift coding.

In the field of 3D cameras, Microvision has developed MEMS infrared 3D structured light depth cameras, among which the PDN series of structured light 3D cameras uses MEMS coded grating structured light for scanning, and reconstructs the real 3D point cloud data of the object based on the binocular image recovery algorithm. It meets the needs of industrial-grade high-resolution and sub-millimeter measurement 3D vision applications. The device is small in size, has a large depth of field, high measurement accuracy, low cost, and simple operation. It can be used in scenarios such as biometrics, industrial welding, robots, and 3D object reconstruction.

Structured light 3D camera VS-PDR series It uses MEMS coded grating structured light for scanning and reconstructs the real 3D point cloud data of the object based on the binocular image recovery algorithm. It meets the needs of industrial-grade high-resolution and sub-millimeter measurement 3D vision applications. Compared with PDN, PDR is smaller in size, lighter in weight, can output RGBD format data, and has a wider range of applications.

In the next five years, Weishi Sensing will continue to iterate and upgrade existing MEMS micromirror chips and products, deepen its presence in the relevant fields of 3D sensing, and provide customers with cost-reducing and efficiency-enhancing products and services. Weishi Sensing's goal is to become a well-known domestic MEMS chip solution provider and 3D sensing hardware supplier in five years. Achieving the goal of entrepreneurship is also Weishi Sensing's mission - to make the world smarter.