How to solve the EMI problem of automotive power chips?

Publisher:RadiantBeautyLatest update time:2024-10-23 Source: elecfans Reading articles on mobile phones Scan QR code
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With the rapid development of new energy vehicles and autonomous driving, many EMI problems have occurred in the application of automotive power chips:

First, autonomous driving and smart cockpits have significantly increased power consumption and power usage;

Second, various sensors are more sensitive to power supply noise;

Third, the distributed ECUs and domain controllers and a large number of wiring harnesses make the noise generated by the power circuit easier to propagate and couple.

EMI Challenges Brought by Automotive Power ICs

1. Autonomous driving and smart cockpits significantly increase power consumption and power usage;

2. Various sensors are more sensitive to power supply noise;

3. Distributed ECUs and domain controllers, and a large number of wiring harnesses, make the noise generated by the power circuit easier to propagate and couple.

In actual testing, it also brings great challenges.

1. Conducted high-frequency noise is difficult to suppress;

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2. Common mode current will not only cause transmission test failure, but also cause spatial radiation noise;

f8f13e2a-d75d-11ee-a297-92fbcf53809c.png

3. Radiated noise poses great challenges to device selection and circuit design of PCB layout.

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Is it possible to solve the EMI problem of automotive power chips in one go?

That’s right! It’s the automotive-grade power module JWQM93902 that meets the latest automotive-grade module AECQ-104 standard certification!

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01

Take multiple EMI optimization measures

02

Integrated Magnetics

03

Proprietary drive technology

04

Optimize frequency jitter technology

05

Symmetrical pin design

06

FC flip chip process

07

High frequency working mode

JWQM93902 has the following four major advantages:

1. Ultra-low EMI noise, reducing debugging difficulty;

f91ea932-d75d-11ee-a297-92fbcf53809c.png f933b908-d75d-11ee-a297-92fbcf53809c.png f937aea0-d75d-11ee-a297-92fbcf53809c.png

2. Ultra-small board area, reducing structural cost;

f943f37c-d75d-11ee-a297-92fbcf53809c.png

3. Super consistent characteristics, reducing repeated design;

4. Super strong EMS characteristics, reducing internal coupling.

f947b87c-d75d-11ee-a297-92fbcf53809c.png

It can also be used as a "super LDO", which is simple and easy to use and solves the pain points of LDO.

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Reference address:How to solve the EMI problem of automotive power chips?

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