Mir Electronics’ 2023 Major Events | Forge ahead in 2023 and set sail in 2024

Some people say that 2023 will be the year of economic downturn

Some people say that 2023 will be a year full of challenges

Some people also say that 2023 is a year full of hope

For Mir

2023 is a year of hard work and progress

This year

We write glory with sweat

We use struggle to write youth

Follow the editor to take stock of Mill’s major events in 2023

Looking forward to the new 2024

New product release to assist development

In 2023, Mir Electronics moved forward enthusiastically, developed many new platform solutions, and launched a total of 10 core board development boards, becoming a comprehensive and high-quality embedded CPU module supplier.

 The foreign-funded platform gathers mainstream MPUs from the four major semiconductor manufacturers and becomes the most comprehensive supplier of foreign-funded industrial processor core boards:

Mir is currently the only chip manufacturer in China that can fully provide entry-level and mid-to-high-end MPUs to mainstream foreign-funded semiconductor manufacturers, and can provide customers with one-stop selection.

 Renesas RZ/G2L, RZG2UL series

 ST MP135MP13x series

∎ TI AM62x series

 NXP i.MX93 series

 The domestic platform has advanced by leaps and bounds, covering all single-core/dual-core/quad-core/octa-core MPUs with different performances, providing the widest range of performance options.

 Xinchi D9 series, covering single core/quad core/six core

 Entry-level Allwinner T113-S, T113-i

 High-performance Allwinner eight-core T527 series

In March, released the core board based on Renesas RZ/G2L

The RZ/G2L core board uses Renesas' RZ/G2L high-end processor (MPU) based on 64-bit Arm®, equipped with dual-core Arm Cortex-A55 with a main frequency of up to 1.2GHz, leading the evolution of 32-bit MPUs to 64-bit in the industrial market.

In April, the core board based on STM32MP135 was released

STM32MP135 is ST's new entry-level embedded development platform, based on the STM32MP135 new generation general-purpose industrial-grade MPU, single-core Cortex-A7@1.0GHz. The core board adopts stamp hole packaging, which is extremely cost-effective. 

In May, the core board based on Allwinner T113-S3 was released.

It uses the Allwinner T113-S3 processor, equipped with the ultimate dual-core A7 domestic processor, with a main frequency of up to 1.2GHz, and the retail price of the Mir core board is as low as 79 yuan.

In June, based on Xinchi D9 series core board

It adopts Xinchi D9 series (D9, D9-lite) domestic high-safety vehicle-grade platform, multi-core Cortex-A55, and has passed the ASIL D and ASIL B certifications of the chip research and development system. It is a domestic high-security vehicle-grade platform.

In August, the core board based on TI AM62x was launched, using LGA + stamp hole packaging

The AM62x processor is TI's new generation of high-performance, ultra-efficient processor in the field of intelligent industrial control. It is equipped with Cortex-A53 up to 1.4GHz CPU and Cortex-M4F @400MHz. It continues the next decade of AM335X and adopts the latest LGA+ stamp hole. Encapsulated, solid and reliable.

In August, the core board based on the domestic Xinchi D9-Pro (D9360) was launched.

Xinchi D9-Pro (D9360) high-performance processor integrates 6 ARM Cortex-A55@1.6GHz high-performance CPUs and 1 ARM Cortex-R5@800MHz to facilitate a safe and reliable high-performance display and control solution.

In September, Allwinner T113-i core board was launched

Allwinner T113-i processor is equipped with 2*Cortex-A7@1.2GHz. After this product was launched, Mir is the core board manufacturer that has launched the Allwinner T113 series with the most complete configurations and the most abundant selections.

In November, RZ/G2UL core board was launched

Mil and Renesas launch a core board using the new 64-bit ARMv8 architecture A55 processor RZ/G2UL for industrial applications to help the development of Industry 4.0!

In December, Xinchi D9-Plus core board was launched

Xinchi D9350 is equipped with 5*Cortex-A55 core, which has high integration, high computing power, high efficiency, high processing power and high access capability, realizing "four cores in one" of CPU, NPU, GPU and MCU, multi-core in one Core, one core and multiple systems! The robot main control selects the D9350 core board.

In December, the Allwinner T527 core board was launched, using LGA packaging

Mir launches the Allwinner T527 series platform, which is packaged in LGA and is based on the Allwinner T527 high-performance embedded processor with optional AI functions. It is equipped with an eight-core A55 high-performance processor, RISC-V co-processor, supports 2Tops NPU, and empowers the edge. calculate.

 Original factory interaction to build an ecosystem together

In 2023, Mir will cooperate with semiconductor manufacturers such as NXP, ST, TI, Renesas, Allwinner, and Xinchi

Maintain a good cooperative relationship, jointly organize lottery activities, project competitions and other interactive activities with fans, and actively participate in industry summits, exchange meetings, etc.

In March, Renesas visited Mir's SMT smart factory, and Mir became a Renesas Electronics IDH ecological partner.

In May, Mir appeared at the ST Summit and delivered a speech

On May 12-13, 2023, Mir will exhibit core modules and industry application demos based on the STM32MP1 series, and grandly promote the new STM32MP135 core module, delivering a speech titled "Mill Core Board Accelerates Product Development Based on STM32MP1". At the same time, a lottery for free development boards was held in the sub-forum, attracting a large number of customers to participate.

In May, Mir and Renesas held the Mir RZ/G2L development board creative show and gave away 150 sets of development boards.

From May to October 2023, Mir Electronics and Renesas jointly launched the "Mirr Electronics & Renesas RZ/G2L Development Platform Creative Show", providing 150 sets of free development boards to support developers' innovative development, and a large number of engineers came to apply for products. In addition There are also outstanding developers who will receive great prizes: 5G mobile phones, smart watches, Bluetooth headsets, etc.

Mir and NXP hold public account lottery

Mir Electronics and NXP organized a lottery event, which attracted a large number of customers to participate and distributed prizes such as i.MX development boards, desk lamps, and blood pressure monitors.

In September, Mir participated in the 2023 STM32 11-city nationwide tour.

From September to October 2023, Mir Electronics participated in 11 exhibitions in Hangzhou, Wuhan, Zhengzhou, Xi'an, Jinan, Chengdu, Suzhou, Nanjing, Guangzhou, Xiamen, and Beijing. Mir Electronics exhibited the latest STM32-related product technologies and applications at the exhibition The demonstration provided an open platform for engineers to talk, communicate and explore together, and also held discount activities, attracting many audience participation.

In October, Mir delivered a keynote speech at the NXP Innovation Technology Forum

On October 10, 2023, the [NXP Innovation Technology Forum] was held at the Shenzhen Bay Renaissance Hotel. As an in-depth partner of NXP, Mir Electronics was invited to give a speech and exhibit innovative products based on NXP MPU chips. Vice President of Mir Electronics General Manager Alan delivered a keynote speech on "Core Boards and Solutions Based on NXP Embedded Processors", attracting many participants to come and learn about it.

In November, Mir assisted TI seminars in Beijing, Shanghai and Shenzhen

In November, the Texas Instruments Embedded Technology Innovation and Development Seminar came as scheduled in Beijing, Shanghai, and Shenzhen! Mir attended the TI conference in 3 cities. Mir Electronics exhibited product solutions and application demonstrations related to AM335x, AM437x, and AM62x on site, and launched a 50% off development board promotion.

In December, Mir appeared at the Renesas seminar and delivered a speech

Mir Electronics, as Renesas' IDH ecological strategic partner, attended the event to jointly promote a new product - the industrial-grade MPU Remi Pi development platform, and shared Mir's experience in the industrial field at the conference. Technological innovation and practical cases, Mil's core boards and development boards based on the RZ series are on display.

In December, Mir participated in the openEuler conference to help upgrade the software and hardware of domestic industrial controllers.

Mir attended the Operating System Conference & openEuler Summit 2023, delivered a speech titled "Industrial Controller Solution Based on Euler System" and exhibited the latest technology application solutions.

In December, Mil showed up at the 2023 Hardware Developer Conference with its domestic Allwinner series core boards.

Mil Electronics' exhibition provides a full range of core modules and supporting evaluation development boards based on the Allwinner T series, including the T113 series, T507 series, and T27 series, with full configurations and multiple choices to meet the diverse selection needs of customers.

 Honorary Awards

Mir NXP i.MX 8M Plus development board won the "Most Popular Reviewed Product Award"

Mil won the Outstanding Partner Award from Electronic Enthusiasts

 Continuous investment to improve services

Increase the construction of Mil SMT factory

In 2023, in order to improve customer service capabilities, Mir will add a high-speed dual-track SMT line in the SMT production workshop to increase production capacity. The factory's patching capacity will reach a daily production capacity of more than 5 million points; a high-temperature aging room will be added in the DIP workshop to support normal temperature to 80 ℃ batch aging to ensure the temperature, power quality, load capacity, working time and other requirements required by the product; build a three-proof workshop equipped with fully automatic three-proof paint coating line body to meet product three-proof production capacity and quality requirements, and provide electronic products Anti-mold, anti-moisture, anti-salt spray, eliminates the adverse effects of complex environments on the performance of electronic devices, and ensures the ultimate accuracy of product delivery.