Infineon will demonstrate at MWC 2023 how its latest semiconductor technologies can help build a more comfortable and environmentally friendly Internet of Things

Infineon will demonstrate at MWC 2023 how its latest semiconductor technologies can help build a more comfortable and environmentally friendly Internet of Things

[Munich, Germany, February 22, 2023] Internet of Things technology makes it possible to overcome many challenges facing today's society, and can even improve quality of life, enhance convenience and increase industrial productivity. Microelectronics technology, including sensors, actuators, microcontrollers, connection modules and security components, is the core of all IoT solutions. Infineon Technologies AG can provide all microelectronics technology-related products and will showcase these products and various supporting services, software and tools to visitors at the 2023 Mobile World Congress (MWC) in Barcelona from February 27 to March 2. As a semiconductor leader in power systems and the Internet of Things, Infineon is working with customers and partners to promote low-carbon and digitalization.

Under the theme of "Jointly Promoting Low Carbonization and Digitalization", Infineon Technologies once again sincerely invites customers to visit the Infineon booth. In addition, customers can also log in to Infineon's digital platform to learn more about the various technologies that Infineon will showcase during and after the MWC. The Infineon booth is located in Hall 5a (Booth No. 51) and will set up several key exhibition areas:

• Enabling healthy living through smart semiconductor solutions

Infineon's semiconductor products meet the requirements of digital health devices and are the perfect partner for smart health devices. These products can support smart home devices that improve health and enable a healthy lifestyle. For example, a smart speaker equipped with a radar sensor can detect heartbeats, whether someone falls, and even coughing or snoring. In this way, Infineon's solutions not only make people's lives more comfortable, but also allow people to enjoy a longer, independent and healthy home life in an increasingly aging society.

• Applying AR technology to enterprise and medical environments

Magic Leap 2 is a pioneer in AR - Magic Leap's latest AR device designed for enterprise and healthcare applications. One of the main features of the latest generation of Magic Leap is the 3D indirect time-of-flight (iToF) depth sensor technology jointly developed by Infineon and PMD. The upgraded new iToF technology can more intuitively connect the real and digital worlds through more flexible gesture control and more precise user interaction, enabling new applications where accuracy and reliability are crucial, such as remote maintenance and diagnosis of industrial machinery, or AI-assisted surgery that allows doctors to better understand the patient's anatomy.

• Low-carbon digital hubs create a greener future

As more and more devices are connected to smart homes and other application scenarios, by 2025, the world is expected to have 175 zettabytes of data to process. This will greatly increase the energy demand of about 8,000 data centers around the world, especially the energy demand for cooling servers. At MWC 2023, Infineon will work with Supermicro to demonstrate how green computing platforms can make an important contribution to the decarbonization of computing. The MicroBlade® series provides outstanding server density for a variety of processors and uses the most efficient OptiMOS™ integrated power stage semiconductors in its class.

• Turn objects into payment devices

Why can only credit cards, smartphones or smart watches be used for payment? Infineon's technology is driving the digitization of payments. With a chip that is only half the size of a ladybug, almost everything from smart watches and fitness trackers to rings and bracelets can be turned into payment devices. At MWC 2023, Infineon will demonstrate how to achieve fast, convenient and secure payment functions with ultra-low power consumption and miniaturization of wearable devices that support near-field communication (NFC), meeting the increasingly demanding security and contactless payment needs of the payment industry.

Infineon and Adidas showcase interactive smart jacket

At this year's Mobile World Congress in Barcelona, ​​Infineon invited Adidas to showcase their collaborative interactive smart jacket prototype at its booth. Adidas' "5G interactive sports jacket" can provide real-time feedback on fitness data, connect to the network anytime and anywhere, and send out SOS alarms in emergencies. Applications such as this embedded clothing or any other wearable device rely on semiconductor technology to turn the jacket into a smart device so that people don't have to carry other mobile devices when exercising.