Rambus expands portfolio of DDR5 memory interface chips for data centers and PCs

Rambus expands portfolio of DDR5 memory interface chips for data centers and PCs

News Highlights:

• Launched the Serial Detection Hub (SPD Hub) and temperature sensor integrated into server and client DDR5 memory module chipsets

• Complements industry-leading DDR5 RCD to deliver leading bandwidth and capacity

• Improved system management and thermal control, lowering total cost of ownership

Beijing, China, August 18, 2022 - As an industry-leading chip and semiconductor IP supplier committed to making data transmission faster and safer, Rambus Inc. today announced that it has expanded its DDR5 memory interface chip portfolio and launched the Rambus Serial Detection Hub (SPD Hub) and temperature sensor to complement the industry-leading Rambus Register Clock Driver (RCD). DDR5 achieves greater memory bandwidth and capacity by adopting a new module architecture with an extended chipset. At the same time, the SPD Hub and temperature sensor also improve system management and thermal control of DDR5 dual in-line memory modules (DIMMs), providing higher performance within the power range required by servers, desktops, and laptops.

Rambus Serial Sense Hub and Temperature Sensor

“The new performance levels of DDR5 memory place higher demands on signal integrity and thermal management for both server and client DIMMs,” said Xianzhi Fan, chief operating officer of Rambus. “With more than 30 years of experience in memory subsystem design, Rambus is able to provide the ideal DDR5 chipset solution to bring breakthrough bandwidth and capacity to advanced computing systems.”

“Close collaboration between Intel and SPD ecosystem partners like Rambus has delivered critical silicon solutions for Intel’s next-generation DDR5-based systems, taking server, desktop and laptop performance to new levels,” said Dr. Dimitrios Ziakas, vice president of memory and IO technologies at Intel. “Our joint efforts to advance DDR5-based computing systems are laying the foundation for multiple generations of Intel DDR5 and a new level of performance in data center and consumer products.”

“DDR5 enables a significant jump in performance for computing systems,” said Shane Rau, vice president of computing semiconductor research at IDC. “However, DDR5 memory modules require new components to operate, and components such as SPD hubs and temperature sensors have become essential components for client and server systems.”

As part of the Rambus server and client DDR5 memory interface chipset, the SPD Hub and temperature sensors combined with RCD can provide high-performance, high-capacity memory solutions for DDR5 computing systems. Both the SPD Hub and temperature sensors are key components on memory modules that can sense and report important data for system configuration and thermal management. The SPD Hub can be used for server and client modules, including RDIMMs, UDIMMs, and SODIMMs, and the temperature sensors are designed specifically for server RDIMMs.

The main features of SPD Hub (SPD5118) include:

• Support I2C and I3C bus serial interface

• Advanced reliability features

• Expanded NVM space to meet customer-specific application needs

• Provides low latency for the fastest I3C bus rates

• Integrated temperature sensor

• Meets or exceeds all JEDEC DDR5 SPD Hub operational requirements (JESD300-5A)

The main features of the temperature sensor (TS5110) include:

• Precision thermal sensing

• Support I2C and I3C bus serial interface

• Provides low latency for the fastest I3C bus rates

• Meets or exceeds all JEDEC DDR5 temperature sensor operational requirements (JESD302-1.01)

Availability and more information

The Rambus SPD Hub and temperature sensor are available now.