Teledyne e2v is now delivering its space-grade DDR4 memory solutions

Grenoble, France - Media OutReach - March 18, 2022 - Teledyne e2v Semiconductor ’s development of ultra-high density memory DDR4 continues with the news that space-grade positives are now shipping to key customers around the world. This marks a major step forward for this groundbreaking project after the success of the samples delivered led to widespread active design and adoption of this technology. As a result, the company is now entering the mass production phase to deliver space-grade radiation-tolerant DDR4.

Teledyne e2v’s DDR4s have a 4Gbyte memory capacity and measure just 15mm x 20mm x 1.92mm, offering a far higher memory density than competing solutions – occupying only half the PCB real estate and almost an order of magnitude less volume. They are high performance and offer data transfer speeds of 2.4GT/s. Each Teledyne e2v DDR4T04G72 memory is available in a multi-chip package (MCP) with an extended bus capability, with 64 bits for data transfer and an additional 8 bits for error correction. The DDR4T04G72 is the best companion to the company’s own Qormino® processors and is also compatible with the vast majority of processors, SOCs and FPGAs from other vendors.

Radiation testing of these DDR4s has shown that their Single Event Latchup (SEL) threshold is greater than 60MeV.cm²/mg. Their Single Event Upset (SEU) and Single Event Functional Interruption (SEFI) data also exceed 60MeV.cm²/mg, and they have demonstrated resilience to 100krad Total Ion Dose (TID).

Teledyne e2v’s DDR4 can be ordered over the industrial temperature range (-40°C to 105°C) It can also be ordered over the military temperature range (-55°C to 125°C) and is NASA Grade 1 compliant (based on NASA EEE-INST-002 - Section M4 - PEMs), which means a wider range of potential applications can be addressed.

“We are regarded as the leader in high-density radiation-tolerant memory for space applications and our technology has already received incredible acclaim in the market. What sets us apart from our competitors is that we offer a comprehensive, open data package that gives customers everything they need to start and complete a design in the shortest possible time, with all background information and expert engineering support readily available,” said Thomas Guillemain, Marketing and Business Development Manager at Teledyne e2v. “We have raised the performance benchmark by providing the space industry with reliable, compact, easy-to-connect memory. We are making great progress on the next phase of our roadmap, with other generations and even higher capacity devices currently in the pipeline.”