Keynote speech on breakthroughs in advanced chip manufacturing technology in the post-Moore era

I would like to emphasize again that it is not enough to have manufacturing processes and high-density interconnection and high-density integration processes. The back-end manufacturing process is becoming more and more important, including Changdian Technology. International leading companies are now strengthening cooperation with the design industry and IPEDA companies, and Mr. Wang from EDA will also talk about it later. Cooperation with these companies must start from the overall collaborative design of the chip, because our density and integration are becoming more and more complex. We must link the wafer manufacturing in the middle of the design with the finished product manufacturing in the back-end during the early planning and design of the chip to ensure the yield and performance improvement. Originally, we said that after the chip design, we roughly made a package design and tested it. Now we need to interact with the chip design, and there must be a system-level work when it is taken to the back-end manufacturing plant. There must be comprehensive coordination from the product structure, physical properties, thermal properties, and computing performance to achieve such a high-computing chip as Mr. Pan of AMD talked about.
   

In addition to design, testing is becoming more and more complicated, which is a problem that people often overlook. Generally, domestic factories, including international testing factories, usually ask customers to give them tests. As we move towards high-density integration and heterogeneous integration, the coordination between the testing link and the previous links is becoming more and more important, from the previous test to the middle link to the final system test and then to the system test of the product. Internationally, there are standardization committees specifically established for heterogeneous integration. Changdian Technology has become an important member of these very critical standardization committees at a very early stage, combining testing and high-density chip integration to form the key manufacturing process for the finished chip of a complete integrated circuit device.
   

What I want to share with you are these two main points, let me summarize them.
   

We believe that in the post-Moore era, advanced packaging or packaging has far exceeded the scope of self-intention and has entered the important industrial stage of integrated circuit chip finished product manufacturing. In this regard, in the upgrading of advanced packaging and advanced integrated circuit finished product manufacturing, the academic leaders have fully realized that its upgrading plays a very important role in the continued advancement of Moore's Law of integrated circuits.
   

This time, Changdian Technology took the opportunity of the World Semiconductor Conference to formally promote the series of XDFOI products for heterogeneous integration to the industry. At the same time, we have established an integrated circuit design service division to combine design services with our customers. In the post-Moore era, we believe that we can build a better integrated circuit industry.