GigaDevice Selects Arteris Products for Development of Next-Generation Automotive SoCs Compliant with Enhanced FuSa Standard-EEWORLD

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The physically-aware FlexNoC 5 interconnect IP improves placement and routing efficiency and reduces interconnect area and power .

CAMPBELL, Calif. – November 19, 2024 – Arteris, Inc., a leading provider of system IP dedicated to accelerating the creation of system-on-chips (SoCs), today announced that GigaDevice has licensed its FlexNoC 5 interconnect IP to improve product performance, reduce power consumption, and accelerate time to market . These solutions provide flexibility and cost-effectiveness to support companies developing advanced technologies.

GigaDevice is committed to meeting the stringent standards of the automotive industry and focuses on technological innovation and product quality. Its product series has been verified by the industry to provide the required high performance, high reliability, and functional safety for automotive-grade applications, meeting the needs of modern automotive electronic technology.

“We selected Arteris because of its strong track record in interconnect technology and experienced support team,” said Sherry Jia, senior director of MCU Division at GigaDevice . “FlexNoC 5 is particularly valuable in managing complex functional safety standards.”

“We are excited to bring our advanced interconnect IP to GigaDevice’s automotive products,” said K. Charles Janac, Arteris President and CEO . “We are committed to supporting our customers in creating cutting-edge automotive solutions that meet the highest safety and performance standards.”

Arteris' FlexNoC 5 interconnect IP offers high performance, flexibility, and scalability. It integrates hardware reliability and functional safety features to ensure compliance with industry standards. The physical awareness of the NoC enables SoC architects to anticipate design challenges early, significantly reducing iteration cycles.

Keywords：GigaDevice Reference address：GigaDevice Selects Arteris Products for Development of Next-Generation Automotive SoCs Compliant with Enhanced FuSa Standard

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