Mir's new core board! Xinchi D9 domestically produced high-security automotive-grade development platform
With the rapid development of information technology, the market demand for chips is increasing. Since the 1980s, China's chip industry has entered a new era after nearly 40 years of hard work. The localization of chips is the general trend of future development. As an industry-leading embedded module manufacturer, Mir Electronics closely follows the development strategy of localized chips. After launching the domestic-Allwinner entry-level T113 and T507 series core modules, it has cooperated with CoreChi to launch the domestic automotive-grade D9 series products based on high security and high performance - MYC-JD9X core board and development board.
Figure: CoreChi D9 series MYC-JD9X core board and development board
CoreChi D9 series high-security, automotive-grade domestic platform
The MYC-JD9X core board and development board based on the domestic platform CoreChi D9 series are not only localized, but also have high performance, high security and high reliability. This D9 chip has passed the ISO 26262 ASIL B functional safety product certification and all test items of the AEC-Q100 automotive-grade chip. It is designed for the new generation of power smart devices, industrial Internet equipment, industrial control equipment, industrial robots, construction machinery, rail transit and other advanced industrial applications.
Figure: High-security CoreChi D9 series MYC-JD9X core board and development board
CoreChi D9 integrates ARM Cortex-A55 high-performance CPU
The D9 series processor integrates 1/4/5/6 core ARM Cortex-A55 high-performance CPU and 1/2/3 ARM Cortex-R5 real-time CPU. It includes 3D GPU and H.264 video codec. In addition, the D9 series processor also integrates PCIe3.0, USB3.0, Gigabit Ethernet, CAN-FD, UART, SPI and other rich peripheral interfaces, which can be seamlessly applied to various industrial applications at the lowest cost.
The D9 series processors also integrate high-performance, high-security HSM processors, supporting TRNG, AES, RSA, SHA, SM2/3/4/9. They have secure boot and supporting secure OS, and all-round hardware ECC verification of DRAM & SRAM & CACHE.
D9 series processor block diagram
314PIN gold finger design, 8-layer high-density PCB The MYC-JD9X core board of the Core Chi D9 series adopts a high-density high-speed circuit board design. It integrates D9 series processors, power supplies, LPDDR4, eMMC, QSPI, EEPROM, watchdog chips and other circuits on a board with a size of 82mmx45mm. The board adopts an 8-layer high-density PCB design, produced by immersion gold process, independent ground signal layer, and lead-free. The core board and the baseboard are connected with a gold finger connector. The core board gold finger specification is a universal gold finger of 314PIN MXM3.0 specification, and the baseboard needs to use the corresponding gold finger connector.
Core Chi D9 series MYC-JD9X core board
Meets the requirements of high-performance smart devices
The MYC-JD9X core board of the CoreDrive D9 series has the most stringent quality standards, ultra-high performance and computing power, rich high-speed interfaces, high cost performance, and long delivery time. It is suitable for the core board requirements required by high-performance smart devices.
Supporting development board to help development success
The Xinchi D9 series MYD-JD9X development board adopts 12V/2A DC power supply and is equipped with 2 Gigabit Ethernet interfaces supporting TSN function, 1 USB3.0 protocol M.2 B-type socket 5G/4G module interface, 1 onboard SDIO/serial port protocol WIFI/Bluetooth module, 1 PCIE3.0 protocol M.2 B socket SSD module interface, 1 HDMI interface, 1 single-channel LVDS display interface, 1 dual-channel LVDS display interface, 1 MIPI CSI interface, 1 audio input and output interface, 2 USB3.0 HOST Type A interfaces, 1 USB2.0 OTG Type-C interface, 1 Micro SD, 2 isolated RS485 interfaces, 2 RS232 interfaces, 2 isolated CAN interfaces, 2 isolated DI interfaces, 2 isolated DO interfaces and other expansion interfaces.
CoreChi D9 Series Smart Box
To facilitate customers in industries such as industrial gateways and commercial displays, Mir launched the CoreChi D9 series smart box, which provides complete white box hardware, with drivers and optional multiple operating systems, to facilitate users to carry out secondary development and greatly accelerate product launch. The thickened metal shell is equipped with an anti-corrosion coating and an IP40 protection level to ensure durability and reliability in complex industrial environments. It is suitable for desktop installation and wall-mounted installation, and the on-site layout is flexible and convenient. There are two versions: 4G and 5G.
Rich development resources
The CoreDrive D9 series MYD-JD9X development board provides rich software resources to help customers develop products as quickly as possible. When the product is released, you can get all the Linux BSP source code and rich software development manuals.
About Mir
Shenzhen Mir Electronics Co., Ltd. is a high-tech enterprise focusing on the design, development, production and sales of embedded processor modules. Mir Electronics has more than 10 years of R&D experience in the field of embedded processors, providing customers with products and services such as CPU modules and charging control systems based on ARM architecture and FPGA architecture; providing customized solutions and OEM services for customers in industries such as smart medical care, smart transportation, smart security, Internet of Things, edge computing, industrial gateways, and artificial intelligence. The company helps customers accelerate the process of product launch through professional and efficient services, and currently serves more than 10,000 corporate customers in the industry.
Core Chi D9 series MYC-JD9X core board parameters
Core Chi D9 series MYC-JD9X core board expansion signal
CoreChi D9 series MYD-JD9X development board parameters
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