BYD's self-developed smart driving chip may be ready for tape-out by the end of the year

Recently, media reported that BYD is planning to independently develop a special chip for intelligent driving. The project is led by BYD Semiconductor Team, which has sent out requirements to design companies and is also recruiting BSP technical teams. "If the progress is fast, it can be taped out by the end of the year." At the same time, BYD is also recruiting BSP technical teams. The role of BSP is to provide a standard interface for the operating system running on the chip.

It is understood that BYD's semiconductor team has been established for 20 years, during which it has successively launched products such as IGBT chips, automotive-grade MCU chips, and analog IC chips.

However, BYD's focus has previously been on new energy technologies, and it has not made much in the fields of automatic assistance and intelligent driving. Now, its efforts in autonomous driving chips show that BYD has taken a solid step in this field.

In fact, BYD has already entered the field of smart cockpit and driving through cooperation. In April this year, BYD and Horizon officially announced a fixed-point cooperation. Some models are equipped with Horizon's high-performance, high-computing-power autonomous driving chip Journey 5 to achieve high-level autonomous driving functions.

According to the plan, BYD models equipped with Horizon Journey 5 will be launched as early as mid-2023. The chip has both high computing power and high performance. The AI ​​computing power of a single chip can reach up to 128 TOPS, supporting 16-channel camera perception computing and supporting multi-sensor fusion, prediction and planning control required for autonomous driving.

Now, BYD is also developing its own dedicated chips for intelligent driving, and BYD's strategic plan to make breakthroughs in autonomous driving and core chips for smart cars has become clearer.