TaiSilicon Microelectronics announces mass production of automotive-grade smart touch SoC chip solution TCAExx-QDA2

Shanghai, China, March 10, 2022 - Shanghai Taishi Microelectronics Co., Ltd. (hereinafter referred to as "Taishi Micro"), a leading Chinese supplier of high-performance dedicated SoC chips, announced the mass production of TCAEXX-QDA2, a series of SoC chips and solutions for automotive smart surfaces and smart touch switches. This release includes two chips, TCAE11-QDA2 and TCAE31-QDA2, both of which have passed the complete AEC-Q100 Grade 2 reliability certification test.

The TCAEXX-QDA2 series is a high-reliability dedicated SoC chip based on the ARM Cortex-M0 core, with an operating frequency of 32MHz, built-in 64KB Flash and 4KB SRAM, supports LIN bus communication, and has high anti-interference and up to 8kV HBM ESD performance. Taishi Micro continues to uphold the product development concept of high performance, high integration and high reliability. The chip integrates high-performance analog circuits and hardware acceleration modules required to realize capacitive touch and pressure sensing. With Taishi Micro's independent intellectual property intelligent algorithm, it is the world's leading automotive smart button and smart surface solution.

TCAE11-QDA2 is an automotive-grade capacitive touch SoC chip that supports up to 10 channels of capacitive touch detection. It is used to implement functions such as smart buttons or sliders and is suitable for various application scenarios such as in-car reading lights, ambient lights, central control, air conditioning control, steering wheels, door handles, etc.

TCAE31-QDA2 includes all capacitive touch functions of TACE11-QDA2 , and also integrates Wheatstone bridge analog front-end circuit, including low-noise voltage source, 2-stage PGA with a maximum gain of 1024 times, high-precision ADC, offset voltage dynamic compensation and other circuit units, which can achieve 22 bits wide dynamic and minimum 3.6uV signal measurement, suitable for external various forms of bridge sensors for pressure detection and measurement functions, suitable for signal conditioning and acquisition and algorithm processing of various pressure sensors such as MEMS pressure sensing, strain gauge pressure sensing, and resistance pressure sensing. It is the world's first automotive-grade SoC chip that integrates capacitive touch and pressure touch at the same time. TCAE31-QDA2 fully considers the complex changing factors that may be faced in actual applications, such as parameter changes caused by assembly, temperature, humidity, aging, interference, etc., and realizes the continuous reliability of pressure detection through wide-range real-time dynamic compensation combined with intelligent algorithms. Combined with the capacitive touch channel, a capacitive + pressure-sensitive composite smart button can be realized, which can truly achieve the high reliability requirements of high anti-interference, anti-mistouch, waterproof, etc. required for automotive applications. It is suitable for complex in-vehicle and out-of-vehicle application environments such as smart surfaces, smart B-pillars, smart central controls, smart logos, and smart door handles.

TCAE11-QDA2 and TCAE31-QDA2 are QFN-28 packages with simple peripheral circuits. External LIN SBC can realize communication with BCM. Taishiwei provides a full range of software and hardware platforms for evaluation, testing, and production, covering chip evaluation, vertical solutions, production, and simulation debugging download tools, etc., providing customers with one-stop services. Both products have been officially mass-produced, with sufficient supply to meet large-scale application needs.