OMNIVISION Launches Industry's First Ultra-Low-Power SoC for Automotive Cameras with 3MP Resolution-EEWORLD

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According to foreign media reports, OMNIVISION, a developer of semiconductor solutions, announced the launch of a new series of OX03D4C, a 3 MP resolution system-on-chip (SoC) OX03D for automotive surround view systems (SVS), rear view systems (RVS) and electronic rearview mirrors. The new SoC provides automotive OEMs with a seamless path from 1MP to 3MP while maintaining high performance, low power consumption and a minimum pixel size of 2.1μm in a 1/4-inch optical format. The OX03D4C has a fully integrated image signal processor (ISP) capable of achieving 140dB high dynamic range (HDR), and includes a next-generation tone mapping algorithm as well as industry-leading LED flicker suppression (LFM) performance.

OMNIVISION Launches Industry's First Ultra-Low Power 3MP Resolution SoC for Automotive Cameras

(Image source: OMNIVISION)

“Customers are demanding higher performance solutions for viewing applications. The OX03D4C is the first to market, offering a compact, yet feature-rich footprint,” said Andy Hanvey, Director of Automotive Marketing at OMNIVISION. “Our OX03D SoC enables automotive OEM customers to transition from 1MP to 3MP while maintaining the same optical format and mechanics as previous generation solutions, accelerating time to market for high-demand SVS cameras.”

OMNIVISION's OX03D4C includes a pixel array ISP in a single package. The product is optimized to provide ideal performance over the entire automotive temperature range. The SoC features 105dB motion-free HDR, a total range of 140dB, and provides both HDR and LFM, in addition to a next-generation tone mapping algorithm for high-contrast images, support for multiple CFA modes, and can output YUV and RAW processing streams simultaneously. The OX03D4C offers four screen display overlays for driver guidance, as well as distortion correction to straighten any curved edges of lenses with wide viewing angles. Its power consumption is less than 500 mW, so a plastic housing can be used to save weight and reduce costs.

All of these features are built into the smallest camera module available for automotive viewing applications. The SoC is packaged in an a-CSP™ package, enabling ultra-small cameras to fit in tight spaces. The image sensor is built on OMNIVISION’s PureCel® Plus-S stacked chip technology, which separates the image sensor array from the image sensor processing pipeline. This configuration enables additional system functionality and improves sensor performance while enabling a smaller footprint compared to non-stacked sensors. As a result, sensors built with PureCel® Plus-S technology deliver best-in-class image quality and high performance at the smallest chip size.

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