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SE5535F

Part NumberSE5535F
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size2146.6,7 Pages
ManufacturerSignetics
Download Datasheet Parametric

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Part Number Manufacturer Description
SE5535F NXP Semiconductors SE5535F amplifier basic information:SE5535F is an OPERATIONAL AMPLIFIER. Commonly used packaging met...

SE5535F Overview

SE5535F amplifier basic information:

SE5535F is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP14,.3

SE5535F amplifier core information:

The minimum operating temperature of the SE5535F is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum bias current at 25°C is: 0.08 µA Its maximum average bias current is 0.1 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of the SE5535F is 15 V/us. The manufacturer's maximum slew rate for the SE5535F is 6.6 mA, while the minimum slew rate is 10 V/us. Its minimum voltage gain is 25000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the SE5535F gain becomes 0.707 times the low-frequency gain is 1000 kHz.

The nominal supply voltage of the SE5535F is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of the SE5535F is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of SE5535F:

SE5535F has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm.

SE5535F amplifier additional information:

SE5535F adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of SE5535F is: YES. Its temperature grade is: MILITARY. SE5535F is not Rohs certified.

The corresponding JESD-30 code is: R-CDIP-T14. The corresponding JESD-609 code is: e0. The package code of SE5535F is: DIP. The materials used in the SE5535F package are mostly CERAMIC, METAL-SEALED COFIRED. The package shape is RECTANGULAR.

The SE5535F package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.

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