GigaDevice wins the "2021 China Automotive Supply Chain Outstanding Innovation Achievement" award

Nationally produced automotive-grade flash memory chips safeguard the future of industrial chips

Beijing, China (October 15, 2021) — GigaDevice, an industry-leading semiconductor device supplier, announced that at the 2021 China Automotive Supply Chain Conference held in Chongqing on October 15, GigaDevice's domestically produced automotive-grade flash memory chip GD25LX512ME/GD25X512ME won the "Excellent Innovation Achievement in the Supply Chain" award. This is the first time that a Chinese integrated circuit company has won such an honor.

The China Automotive Supply Chain Conference is hosted by the China Association of Automobile Manufacturers. It is an industry event jointly organized by the government, industry, academia, research and application. It has been successfully held for 19 sessions so far. This conference is themed "Compensating for shortcomings and building strengths, integrating innovation-building a new ecology of China's automotive supply chain". It aims to bring together upstream and downstream companies in the supply chain with a global perspective, clarify strategic directions, explore cooperation models, share innovative technologies, and plan the future of the industry. The selection of "Excellent Innovation Achievements in China's Automotive Supply Chain" is a heavyweight link launched for the first time, and the competition is extremely fierce. The shortlisted projects are all from leading companies and represent the highest level of the industry. As an industry-leading semiconductor design company, GigaDevice's domestically produced automotive flash memory chips "GD25LX512ME and GD25X512ME" stand out from many projects, demonstrating the industry's high recognition of GigaDevice's R&D strength and product competitiveness, and strengthening GigaDevice's benchmark position in China's integrated circuit industry.

GigaDevice's domestically produced automotive-grade flash memory chip GD25LX512ME/GD25X512ME is a high-speed 8-channel SPI NOR Flash product and the industry's highest-performance NOR Flash solution. It has achieved localization in all aspects of design, production, packaging, testing, and sales, and can help the supply chain achieve security, reliability, and independent control. The product has a maximum clock frequency of 200MHz and a data throughput of 400MB/s, which is more than 5 times that of existing products. Its 8-channel SPI protocol and packaging specifications fully comply with the latest JEDEC JESD251 standard specifications. It has built-in ECC algorithm and CRC verification functions, which improve reliability while extending product life. The DQS and DLP functions provide guarantees for high-speed system design. The product has passed AEC-Q100 certification and can provide strong support for applications with strict requirements for high performance, such as intelligent networking, smart cockpits, autonomous driving, as well as AI and IoT.

As an industry-leading chip supplier, GigaDevice has been committed to working with upstream and downstream partners in the industry chain to jointly promote technological innovation and industrial exploration, embrace the new round of scientific and technological revolution with a positive attitude, and strive to build a new ecosystem of symbiosis and common prosperity in the supply chain system, continuously contributing to the development of China's automotive industry.

About GigaDevice

Beijing GigaDevice Technology Co., Ltd. is a world-leading fabless chip supplier. The company was founded in April 2005 and is headquartered in Beijing, China. It has branches in many countries and regions around the world, with a global marketing network that provides high-quality and convenient localized support services. GigaDevice is committed to building a complete ecosystem with memory, microcontrollers and sensor business segments as the core driving force, providing complete product technology and services to customers in the fields of industry, automobiles, computing, consumer electronics, the Internet of Things, mobile applications and communications. It has passed the DQS ISO9001 and ISO14001 management system certifications, and has established strategic partnerships with many world-renowned wafer foundries and packaging and testing plants to jointly promote technological innovation in the semiconductor field.