NXP and BAIC Group sign a strategic cooperation agreement

Publisher:微电子旅人Latest update time:2019-09-09 Source: EEWORLDKeywords:NXP Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

NXP Semiconductors N.V. (NXP), the world’s largest supplier of automotive electronics and leading secure IoT solutions, today announced that it has signed a strategic cooperation memorandum (MOU) with Beijing Automotive Group Co., Ltd. (BAIC Group). The two parties will conduct R&D and commercial cooperation in the areas of automotive digitalization, secure IoT applications and technology integration, including secure car access, car sharing, cloud services, battery management and ADAS.

 

The signing of this cooperation agreement was made during the visit of German Chancellor Angela Merkel to China, and promoting mutually beneficial cooperation between China and Germany in the field of intelligent connected vehicles was also one of the focuses of this visit. Kurt Sievers, global president of NXP, as a member of the German business delegation visiting China, signed the cooperation agreement with Xu Heyi, secretary of the Party Committee and chairman of BAIC Group.

 

image.png 

NXP Global President Kurt Sievers (left) and BAIC Group Party Committee Secretary and Chairman Xu Heyi (right) jointly signed a cooperation agreement

 

Kurt Sievers, President of NXP, said: "The rise of artificial intelligence and Internet of Things technologies is about to change the face of the automotive industry, and the active exploration of digitalization by Chinese automotive companies is accelerating this change. As a leading global supplier of secure connected car solutions, NXP is very pleased to work with BAIC Group to promote the process of automotive digital innovation. At the same time, as a European company, we are also very honored to continue to deepen win-win cooperation with Chinese companies and promote technical exchanges and trade cooperation between China and Europe."

 

Xu Heyi, Party Secretary and Chairman of BAIC Group, said: "Focusing on the deep integration of new energy technology and intelligent network technology and promoting dual-wheel drive development is the future strategic development direction of BAIC Group. NXP has world-leading technology and profound industry experience in automotive electronics, Internet of Things and security. We hope that the cooperation between the two parties can create intelligent network new energy boutique models that exceed user expectations and further promote the high-quality development of China's automotive industry."

 

Chen Jiang, deputy general manager of BAIC Group, secretary of the Party Committee and chairman of BluePark Information, said: "Informatization technology has become one of the focuses of competition in the automotive industry. The combination of the automotive industry and informatization is creating huge value and will also inject new momentum into the automotive industry. We hope to accelerate the construction of BAIC's informatization platform with the help of NXP's world-leading technology."

 

It is reported that BAIC Group will entrust BAIC BluePark Information Technology Co., Ltd. to implement the subsequent cooperation work between the two parties, and both parties will jointly appoint special personnel to form a joint working group.


Keywords:NXP Reference address:NXP and BAIC Group sign a strategic cooperation agreement

Previous article:Uber's four years of autonomous driving
Next article:Jaguar Land Rover and BlackBerry team up to help develop smart cars

Latest Automotive Electronics Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号