In recent years, in order to improve the recognition of radar systems and the quality of wireless communications, researchers have made every effort to develop transceivers that can operate in the millimeter microwave band with a frequency greater than 30 GHz. High-frequency integrated circuits are used to receive and transmit millimeter microwave signals, and the physical properties of compound semiconductors are very suitable for high-frequency environments, so they are currently often used in high-frequency integrated circuits (Figure 1). However, in order to integrate signal processing circuits on a chip, improve product performance, and facilitate large-scale production, silicon semiconductors become more suitable (Figure 2), which is why silicon semiconductors were selected as components of millimeter microwave transceiver integrated circuits.
Figure 1 Compound semiconductor integrated circuit
Figure 2 Silicon semiconductor integrated circuit
Millimeter microwave transceiver integrated circuits generate millimeter microwave signals by using a signal generation circuit. Traditional signal generation circuits compare a low-frequency comparator signal separated from the millimeter microwave oscillation signal with a low-noise, highly stable reference signal, where the comparator signal is separated from the millimeter microwave oscillation signal and the reference signal comes from a reference oscillator. These two signals are then integrated and synchronized together to ultimately generate a low-noise, highly stable signal (Figure 3).
Since the reference signal and the comparator have the same frequency and the comparison process is performed only once in one cycle, the comparison result between the phase difference signal and the noise generated by the phase difference detection circuit will not be large enough, which will eventually lead to the problem of high noise level. It is also worth noting that the noise level generated by transistors processed by silicon semiconductors is higher than that of compound semiconductors. Reducing the noise level and generating high stability signals have become an important direction for the development of integrated circuit technology.
This newly developed technology uses a completely new structure, where multiple phase difference detection circuits are linearly connected with delay circuits, making multiple comparisons possible. In the new integrated circuit, the frequency of the comparison signal is also increased, and the reference signal is separated into multiple signals, so that multiple comparisons can be performed in one cycle. Phase difference signals are generated after each comparison, and thanks to the larger number of differential signals, their relative size is much larger than the noise generated by the phase difference detection circuit, thus reducing the impact of noise.
Figure 4 New signal generation circuit
The low-noise signal generation circuit also uses multiple comparators to achieve continuous comparison with the reference signal. The final noise level is reduced by 5 decibels, in other words, the noise is reduced by one-third on the basis of the original level. In addition, the lower noise level also reduces the consumption of electrical energy and even reduces the number of necessary components, reducing the burden on the environment.
The low-noise signal generation circuit developed by Fujitsu has made all the preparations for the production of fully integrated millimeter microwave band transceiver circuits on silicon semiconductors. This new technology is expected to significantly improve the performance of automotive radar and other wireless transceivers. Of course, whether the product can be mass-produced is also an important factor affecting the future development of the technology. In order to apply this advanced technology, Fujitsu plans to build a single-chip millimeter microwave transceiver integrated circuit module. A large amount of data has been collected on this new technology in the "Advanced Technology Research of 79 GHz Radar System" carried out in Japan, and more details will be disclosed at the 2013 European Microwave Integrated Circuit Conference.
Previous article:Putian Research Institute launches the world's first 4G satellite vehicle system
Next article:Garmin Gemini navigation improves image processing speed
- Popular Resources
- Popular amplifiers
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- How much do you know about intelligent driving domain control: low-end and mid-end models are accelerating their introduction, with integrated driving and parking solutions accounting for the majority
- Foresight Launches Six Advanced Stereo Sensor Suite to Revolutionize Industrial and Automotive 3D Perception
- OPTIMA launches new ORANGETOP QH6 lithium battery to adapt to extreme temperature conditions
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions
- TDK launches second generation 6-axis IMU for automotive safety applications
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- ASML predicts that its revenue in 2030 will exceed 457 billion yuan! Gross profit margin 56-60%
- Detailed explanation of intelligent car body perception system
- How to solve the problem that the servo drive is not enabled
- Why does the servo drive not power on?
- What point should I connect to when the servo is turned on?
- How to turn on the internal enable of Panasonic servo drive?
- What is the rigidity setting of Panasonic servo drive?
- How to change the inertia ratio of Panasonic servo drive
- What is the inertia ratio of the servo motor?
- Is it better for the motor to have a large or small moment of inertia?
- 135 classic design examples of Verilog
- What is the difference between WiFi 6 routers and WiFi 5 routers
- 100 Practical Tips for FPGA Design Experts (English Original).zip
- EEWORLD University Hall----New Raspberry Pi 4: Can it replace your PC?
- SHT31 Review + Preliminary Understanding of Evaluation Board
- [Red Envelope Ask] Linux kernel outputs garbled code after entering the serial console
- How to calculate the temperature rise of MOS tube and LDO in the most reasonable way
- Review summary: Experience the fresh goods of live broadcast ~ ST60 short-distance, non-contact connector
- Maxim has a letter, received the evaluation board
- How to calibrate a vector network analyzer?