The world's first 2D/3D video conversion real-time processing chip: DA8223

Dialog Semiconductor Co., Ltd. recently announced the launch of the world's first 2D/3D image conversion real-time processing chip: DA8223. The chip provides 2D/3D video image real-time conversion processing functions for various portable devices including smartphones and tablets. The device also integrates a parallax barrier screen driver, allowing users to watch 3D content without glasses.

The chip analyzes each frame of 2D video images, and creates a layered depth map (Z-depth) by separating the foreground image and the background image. As a result, each original image pixel is mapped to the left eye and the right eye, and when viewed through a display with a parallax barrier, a 3D image effect can be directly rendered. DA8223 integrates a complete 2D/3D image conversion algorithm. Compared with traditional software-based solutions, the chip does not bring additional burden to the main application processor during 2D/3D image conversion, and does not require external memory.

“The demand for 3D experiences on smartphones is here, but there is very little 3D content available. By using the DA8223, we can create a truly unique device that allows users to instantly experience unlimited 3D content without compromising battery life,” said Mark Tyndall, vice president of corporate development and strategy at Dialog Semiconductor.

“DA8223 is the first hardware-based 2D/3D image conversion technology optimized for a wide range of portable devices. It requires virtually no software development and requires minimal battery and computing power compared to software-based implementations using application processors,” added Mark.

By supporting 60 frames per second for both images and video, and the system's ability to display 3D content in real time in both landscape and portrait formats, the DA8223 ensures a richer and more comfortable 3D viewing experience for content that is essentially 2D, even during extended use.

The DA8223 is compatible with the widest range of 3D-capable displays, from 3.8-inch smartphones to 10-inch tablets. It also works with any display device equipped with a parallax barrier, including OLED and the latest TFT displays from Sharp.

The chip, in a 5x5mm, 81-ball UFBGA package, can be mounted on a printed circuit board between the application processor and the 3D display, or mounted on a display module using a COF process. Samples of the device will be available in early 2011, with mass production of handheld products to be assured in the second half of 2011.