TaiSilicon Micro releases ultra-low-cost high-voltage MCU chip TCHV4018L

Market Background

Intelligence and electrification are the two major directions of the development of the automotive market. The requirements of intelligence have brought new challenges to the entire automotive electronic and electrical architecture. Some isolated control units in the original architecture usually only need simple electrical control and have relatively low requirements for external resources of the chip, but at the same time require remote nodes to have the ability to communicate with the domain control, and some remote nodes need to have certain computing capabilities to perform local fusion processing on the data collected by the sensors or to perform simple control on the execution units and monitor their operating status.

The traditional control architecture adopts a discrete solution with independent LIN transceiver, power supply LDO and MCU. There are pain points such as large control board area, excess MCU resources, high overall cost, and poor system reliability. Taishiwei's newly released TCHV4018L integrates the 32-bit M0 MCU with the LIN transceiver and LDO power supply on a single chip, achieving a perfect combination of extremely low cost and extremely high cost performance, providing a highly competitive solution for automotive intelligent sensing and intelligent execution components. The single-chip solution of TCHV4018L will be nearly half of the overall cost of the traditional MCU+LIN+LDO discrete solution, with an incomparable ultra-high cost performance.

Product Features

• Working voltage 5.5V~18V, supports 40V load dump voltage

• Deep sleep power consumption 70uA, supports LIN wake-up

• ARM Cortex M0 core, 48MHz high frequency clock, 64 KB with ECC Flash and 4 KB SRAM

• Integrated 5V/150mA and 1.2V/10mA LDO for external use

• Support 4-channel 16-bit PWM output

• Supports 14-bit SARADC, sampling frequency up to 500KSPS, internal integrated PGA, maximum 16x gain, capable of collecting 5 single-ended signals (including 1 pair of differential signals)

• Integrated 2-way LIN interface supports both master and slave nodes, one of which has an internal integrated transceiver

• Support 1 SPI interface, maximum communication rate 20MHz

• Integrated LIN transceiver physical layer and data link layer compliant with LIN2.x and J2602 standards

• The LIN interface supports switching between 115Kbps high-speed mode and 20Kbps normal mode

• Internal integrated temperature sensor

• The power supply complies with ISO7637 and ISO16750 surge and transient voltage standards

• PackageDFN16 3mm*4mm

• AEC-Q100 Grade 1, Tj=-40°C~150°C

Chip internal block diagram

Figure 1 System framework diagram

Product Advantages

Ultimate peripheral resource optimization and cost-effectiveness

Targeted and simplified resource configuration eliminates redundancy, providing 1 SARADC, 4 PWMs, 1 SPI, 9 GPIOs, 2 LIN SCI interfaces and 2 UARTs, pursuing the ultimate cost-effectiveness.

Single-die design improves performance and reliability

TCHV4018L uses the leading mixed-signal single wafer process to integrate high-voltage analog, embedded storage and other analog and digital peripherals into a single chip, with outstanding advantages in cost, performance, reliability and size.

Low power consumption

Thanks to the single-chip design of TCHV4018L, the power consumption modes between internal units can be flexibly configured to meet the requirements of various application scenarios for power consumption modes. It typically supports LIN wake-up mode, and the chip standby power consumption can achieve an indicator of less than 70uA, which can easily meet the power consumption requirements of almost all car manufacturers for components, and leave additional power consumption margin for peripheral auxiliary protection circuits.

Small size

Based on single-chip design and extreme optimization of chip resources, the size of the entire product is only 3mm*4mm. Compared with discrete and packaged chip solutions, the advantages are very prominent.

Good LIN compatibility

The TCHV4018L LIN transceiver and data link layer are based on the mature LIN transceiver IP design of Taishi Micro, which can well meet the latest LIN compatibility requirements such as LIN2.X and SAEJ2602:2021.

Excellent EMC characteristics

TCHV4018L has focused on EMC issues since the chip design stage, added necessary protection measures in power management and LDO circuit design, improved PSRR performance, and made TCHV4018L easily pass ISO7637 and ISO16750

Tests for ISO11452, CISPR25, SAEJ2962-1 and other related EMC standards.

Typical application scenarios

TCHV4018L has three main application directions:

Actuator nodes: DC motors, taillights, switches, sunroofs, windows, wipers, etc.

Sensor nodes: Rainfall sensor, ultrasonic radar, PM2.5, etc.

Bridge expansion: LIN to LIN bridge, LIN to UART CAN bridge, UART CAN to LIN bridge, etc.

Figure 2 Smart actuator application

Figure 3 Ultrasonic radar application

Figure 4 LIN to LIN bridge application

Figure 5 Application of sunlight and rain sensor

Figure 6 Resistive or capacitive Wheatstone bridge sensor

Ecosystem, tools and technical support

In order to facilitate users to quickly evaluate solutions and help projects land quickly, Taishiwei provides the TCHV4018L EVK development board for users to apply for, and provides a complete SDK development package. For details, please contact sales@tinychip.com.cn.

Figure 7 Ecosystem Toolkit