BEIJING, China – November 8, 2022 – Qorvo®, Inc., a leading provider of RF solutions for mobile, infrastructure and aerospace & defense applications, and SK Siltron CSS, a semiconductor wafer manufacturer, today announced that they have signed a multi-year silicon carbide (SiC) bare die and epitaxial wafer supply agreement.
The collaboration will increase semiconductor supply chain resiliency and better meet the rapidly growing automotive market demand for advanced silicon carbide solutions. The agreement will also provide customers with greater protection and confidence as they adopt Qorvo's industry-leading Gen 4 SiC FET solutions.
SiC devices are superior to traditional silicon materials in terms of handling high power, heat conduction, etc. When used in electric vehicle systems, they can more efficiently transfer power from batteries to motors, increasing driving range by 5% to 10%.
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