ON Semiconductor Launches MOSFET with Innovative Top Cool Package

Top cooling simplifies design and reduces cost, enabling compact power solutions

November 17, 2022 - ON Semiconductor, a leader in smart power and smart sensing technologies, announced a new series of MOSFET devices with innovative top-side cooling to help designers solve challenging automotive applications, especially motor control and DC-DC conversion.

The new Top Cool device uses a TCPAK57 package with a size of only 5mm x 7mm and a 16.5 mm2 thermal pad on the top, which can dissipate heat directly to the heat sink instead of dissipating heat through a traditional printed circuit board (hereinafter referred to as "PCB"). The TCPAK57 package can fully use both sides of the PCB, reduce PCB heating, and thus increase power density. The new design has higher reliability and increases the service life of the entire system.

“Cooling is one of the biggest challenges in high-power designs, and successfully addressing this issue is critical to reducing size and weight, which are also key considerations in modern automotive designs,” said Fabio Necco, vice president and general manager of automotive power solutions at ON Semiconductor. “Our new Top Cool MOSFETs not only demonstrate superior electrical efficiency, but also eliminate the thermal path in the PCB, significantly simplifying the design, reducing size and lowering costs.”

These devices provide the electrical efficiency required for high power applications with RDS(ON) values ​​as low as 1mΩ. They also feature low gate charge (Qg) (65nC), which reduces losses in high-speed switching applications.

ON Semiconductor uses its deep expertise in packaging to provide the industry's highest power density solutions. The first TCPAK57 product portfolio includes 40V, 60V and 80V. All devices can operate at a junction temperature (Tj) of 175°C and meet AEC-Q101 automotive certification and production part approval procedures (PPAP). Coupled with its gull-wing package, it supports solder joint inspection and achieves excellent board-level reliability, making it very suitable for demanding automotive applications. The target application is high/medium power motor control, such as electric power steering and oil pumps.

ON Semiconductor is sampling these new devices now, with full production scheduled to begin in January 2023. Please contact our sales office.

Please visit our website to learn more about Top Cool Package Single N-Channel Power MOSFET.