Nexperia surface mount devices pass board-level reliability requirements for automotive applications

Rugged copper-clip FlatPower package CFP15B is favored by major Tier 1 automotive suppliers for engine control units

Nijmegen, September 10, 2021: Nexperia, a specialist in basic semiconductor devices, announced that its surface mount device, the copper clip FlatPower package CFP15B, has passed the board-level reliability (BLR) test of a leading Tier 1 supplier for automotive applications for the first time. The package will initially be used in engine control units.

BLR is a method for evaluating the robustness and reliability of semiconductor packages. The test follows an extremely strict procedure and is of great significance in automotive applications where safety and reliability are of great importance. As the automotive industry transitions to electric and connected vehicles, the in-vehicle electronic systems are becoming more and more complex, so this certification is crucial.

Guido Söhrn, Product Manager for Bipolar Power Discretes at Nexperia, said: “Achieving BLR certification is a major breakthrough. The CFP15B represents a new generation of thermally enhanced, ultra-thin surface mount devices. It is feature-rich, reliable and rugged, making it ideal for automotive components such as engine control units, transmission control units and many other safety applications such as braking.”

BLR verification confirmed that the reliability performance level of CFP15B is more than twice the expected performance of AEC-Q101. The device can reach 2600 cycles through power temperature cycle qualification, which combines temperature cycle and intermittent operation life test. "Surface mount devices in the automotive industry are subject to some harsh operating environments, and CFP15B has proven its excellent performance in harsh conditions." Guido Söhrn added.

Made of high-quality materials, CFP15B achieves zero delamination in pins, die and clip, which prevents moisture ingress and improves reliability.

CFP15B uses solid copper clips to reduce thermal resistance and improve heat transfer in PCB, making PCB design more compact. Compared with DPAK and SMx packages, the device is 60% smaller in size without sacrificing thermal performance. The smaller size saves a lot of space and brings greater design flexibility.

器件封装可用于不同的功率二极管技术，例如Nexperia的肖特基或快恢复整流器二极管，但也可以扩展到锗化硅功率二极管或双极性晶体管。这显著促进了产品的多样性，涵盖单/双配置和4-20 A范围，简化电路板设计。

About Nexperia

Nexperia, as an expert in producing high-volume basic semiconductor devices, its products are widely used in various electronic designs around the world. The company's rich product portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFET devices, gallium nitride field effect transistors (GaN FETs), as well as analog ICs and logic ICs. Headquartered in Nijmegen, the Netherlands, Nexperia delivers more than 100 billion products each year, and its products meet the stringent standards of the automotive industry. Its products are widely recognized in the industry for efficiency (such as process, size, power and performance), and have advanced small-size packaging technology that can effectively save power consumption and space.

With decades of professional experience, Nexperia continues to provide efficient products and services to high-quality companies around the world, and has more than 12,000 employees in Asia, Europe and the United States. Nexperia is a subsidiary of Wingtech Technology Co., Ltd. (600745.SS), has a large intellectual property portfolio, and has obtained IATF 16949, ISO 9001, ISO 14001 and OHSAS 18001 certifications.