Teledyne e2v HiRel and Integra enter into partnership

Teledyne e2v HiRel Electronics has announced a partnership with California-based Integra Technologies. Under the agreement, Teledyne will leverage Integra’s GaN portfolio on SiC RF power transistor products to deliver optimized power solutions for the space market.

By using Integra, Teledyne e2v HiRel will provide high power RF devices specifically for emerging space applications in the LEO and GEO load markets. Teledyne will also provide high reliability assurance for Integra's popular SiC on GaN power devices for the defense market.

Brad Little, Vice President and General Manager of Teledyne e2v HiRel, said: “Our space customers are demanding RF power devices with higher power density levels and higher frequencies. Our expertise in providing space RF components combined with Integra’s high-performance RF GaN device technology and product portfolio will provide space payload engineers with state-of-the-art power devices.”

“Integra has decades of success enabling a wide range of defense and commercial radar systems with our world-class RF power products,” said Suja Ramnath, CEO of Integra. “We are pleased to partner with Teledyne e2V, with its expertise in anti-jamming, to expand the application of our unique GaN on SiC technology and products into the growing space market.”