COMMB-LED High Efficiency Integrated Surface Light Source Technology Introduction

1. Technical Background

LED light source is the focus of the light source market in the 21st century. As a new type of energy-saving, environmentally friendly green light source product, LED is bound to be the trend of future development and is called the fourth generation of new light source revolution. It has the advantages of long life, high light efficiency , high stability, good safety, mercury-free, radiation-free, and low power consumption. However, the lack of high-efficiency and low-cost integrated light source industry technology is currently the bottleneck restricting the rapid development of white light LED indoor general lighting at home and abroad, and is a common key problem that needs to be solved urgently.

This packaging technology "COMMB-LED high-efficiency integrated surface light source" is a very unique and innovative technology form in the LED industry. It has independent intellectual property rights and is protected by patent clusters formed by numerous patents and software copyrights. Its extremely high cost-effectiveness will gradually become the mainstream packaging technology for the entire LED indoor lighting source.

The Chinese meaning of COMMB-LED light source technology is explained as LED chips . High-efficiency integrated surface light source technology directly attached to a high-reflectivity mirror metal substrate. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no patch process, so the process is reduced by nearly one-third and the cost is also saved by one-third.

2. Technical level of domestic LED industry

At present, LED packaging has various forms. But the overall semiconductor packaging technology is used to adapt to different application occasions, different dimensions, heat dissipation solutions and luminous effects, and its packaging form is also different. LED is mainly classified by packaging form into Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED, COB LED, etc.

In general, COB LED packaging technology is the mainstream technical solution for the LED general lighting industry that is currently recognized by domestic and foreign industries. The LED general lighting industry around the world is working hard to find a cost-effective production solution.

However, no matter what kind of LED is used in the above packaging, it is necessary to design a reasonable packaging form for different application occasions and lamp types, because only the package with good cost performance and comprehensive performance of the light source can become a terminal light source product and obtain good practical application. Different from the above packaging forms, the high-efficiency, low- power integrated packaged indoor lighting source created by our company's 39 patent groups adopts the vertical integration packaging technology of chips and lamps, which is self-contained and widely used in indoor lighting such as LED lamps , LED bulbs, downlights, etc. It has a high degree of integration, greatly reduces the packaging process and lamp assembly process, improves the degree of automation and operating efficiency, reduces costs, and improves the reliability of product quality. Not only is the product environmentally friendly, but the production process is also clean, low-noise, and pollution-free.

3. Development trend of LED packaging light efficiency

As can be seen from the above figure: in 2011, the luminous efficiency of a single LED has reached a packaging level of 150Lm/W, and it is expected to reach a level of 200Lm/W by 2013, which will be three times that of the current fluorescent energy-saving lamps! Therefore, the functional barrier of high luminous efficiency has been eliminated, and cost reduction has become the main obstacle to popularization.

4. Principle of COMMB-LED Technology

This "high-efficiency COMMB-LED surface light source integrated packaging technology" is a new technology formed after in-depth exploration of COB LED packaging technology. It uses imported mirror aluminum substrates with high reflectivity as the direct carrier of LED chips. Through independent and innovative insulating injection molding electrode structures, LED solid crystal, wire welding, and dispensing packaging process innovations throughout the entire industry chain, and the use of self-developed intelligent special machines to form core software and hardware patented technologies, it fully improves the excitation efficiency of the chip, reduces light loss and thermal resistance, eliminates complex bowl and cup injection molding and PCB , SMT, reflow soldering and other processes, meets the current LED industry's high-efficiency integration requirements, and creatively solves the industry bottleneck of high-quality, long-life, and low-cost indoor general lighting.

5. Technical level achieved by COMMB-LED

"High-efficiency COMMB-LED surface light source integrated packaging technology" is a new type of COB-LED packaging light source technology developed through bold innovation and creation based on the existing COB-LED packaging process. This technology fully combines the high-efficiency, glare-free, flicker-free, and high CRI characteristics of indoor general lighting, and vertically integrates the technology across the entire industry chain from chips to packaging to lamps. It greatly reduces and optimizes the process, improves the efficiency of integrated packaging, reduces costs, improves reliability, and reduces the one-time investment cost of equipment. It enables China to break through foreign patent packaging in the field of white light LED packaging COB-LED technology and enter the ranks of the world's advanced countries, forming China's unique COMMB-LED integrated surface light source technology.

6. COMMB LED technology product packaging structure

At present, the LED electrode bracket in the LED tube light source is the carrier of the light-emitting chip and the current introduction device. It is the main heat transfer channel when emitting light and is the core functional device in the LED package. The original structure uses a process scheme in which the LED bracket is stamped from a copper plate as a whole and then electroplated with silver. With this process technology, the material utilization rate is low. At present, the material utilization rate in the industry is only about 30%, which is a large waste and leads to high cost of LED products. On the other hand, due to this structure, the light output efficiency of the chip is low, which affects the LED luminous intensity and service life, affecting the widespread use of the product, and the production process is complicated and the processing efficiency is low. No ideal solution has been found at home and abroad.

The product of this project adopts the light source packaging technology of chip directly attached to aluminum wire, chip electrode and reflector vertical integration, which not only reduces the thermal resistance on the heat transfer channel by 30%, but also improves the light output efficiency by 15%, reduces the manufacturing cost by 30%, and doubles the reliability. For the entire lamp, a large number of PCB processes with strong chemical pollution are reduced. As shown in the following figure:

COMMB-LED high light efficiency integrated surface light source technology packaging structure

VII. Comparison of process advantages between COMM and its peers

1) LAMP-LED production process:

2) SMD-LED process flow:

3) COB power type flat light source product process

4) Product technology of this project

IX. Innovations, technical effects and advantages of this patented technology:

1) This project has formed a complete set of industrialized processes with high technical content and maturity. Similar to the COB process of the SMT industry, compared with similar planar light source packaging forms, it has a higher degree of integration, higher reliability, and greatly improved efficiency. It will surely become the mainstream technology for LED indoor lighting source packaging in the future.

2) This process is completely independently developed and innovated. From raw material control to finished product testing, it is completely different from the bracket type and SMD-LED type processes. It integrates the advantages of COB packaging, greatly reduces the number of processes, reduces labor intensity, and improves production efficiency.

3) Not only are the products of this project energy-saving and environmentally friendly, with no radiation and mercury, but the production process is also energy-saving and environmentally friendly, reducing the high energy consumption and high pollution process of the electroplating process in the PCB process. There is no high energy consumption in the energy-saving lamp production workshop and there is no air pollution caused by a lot of dust.

4) This process uses a special imported high-reflectivity (emissivity greater than 98%) raw material substrate, which greatly stimulates the light output efficiency of the chip and phosphor. Compared with similar surface light sources, its light efficiency is increased by 15%.

5) Unique aluminum wire welding technology and independently developed software programs to match it reduce multiple point alignments, improve point alignment accuracy and reliability, and improve work efficiency; increase the working area of ​​the workpiece and improve the degree of integration.

6) The surface light source lighting effect is more perfectly reflected. Different from the bracket type and SMD dot matrix lighting effect, it is closer to the surface light source effect of ordinary fluorescent lamps and reduces the glare effect.

7) LED lamp tube and its manufacturing method, using mirror aluminum plate as the parallel circuit carrier of LED light-emitting body, can be conveniently designed according to the requirements of the light-emitting body, so that the requirements of secondary light distribution can be easily realized, and the subsequent production process is simplified. Under the premise of ensuring the quality of the light source board, the cost of raw materials is reduced, and the light output efficiency of the light output end is effectively improved.

8) The reflow soldering process was abolished, which reduced the failure of dead lamps and increased the life of chips; the soldering process was cancelled and the more efficient micro-spot welding technology was adopted, which greatly improved the reliability and efficiency of lamp tube assembly.

10. Difficulty of project technology innovation

The project technology covers Optics , thermal, mechanics, electricity, materials and mechanics, etc. The technical categories and professional knowledge involved are wide, and it is an integrated innovation project that combines multiple disciplines and technologies. Therefore, it not only requires high theoretical knowledge, but also can innovatively break through the international patent blockade of LED project technology in Western developed countries such as Japan, the United States, and Europe, and develop a new process for the production of the entire industry chain of LED lamps with completely independent intellectual property rights, successfully solving the three major global problems of improving the light output efficiency of LED lamp packaging, improving heat dissipation performance and low-cost manufacturing, while significantly reducing the manufacturing cost, reflecting the excellent cost-effectiveness, which can be proud of the LED lamp industry.

11. Purpose and significance of COMMB LED packaging technology

At present, new achievements are constantly emerging in the LED industry. The luminous efficiency and color rendering issues that have long plagued LEDs in the field of general lighting have made breakthrough progress in the past year. The entire industry is entering a period of explosive development worldwide.

Compared with energy-saving lamps, the production cost of LED lamps is much higher, which leads to a much higher sales price than energy-saving lamps. This problem has always plagued the popularization and promotion of LED. For this reason, the LED industry at home and abroad is striving to find a cost-effective (cost-reducing) production solution. The biggest feature of the technical solution of this project is that after large-scale implementation, the cost of lamp tubes and bulbs will be reduced by more than 30%, making the initial investment of LED lamp systems completely close to that of traditional fluorescent lamp systems. It will quickly occupy the domestic and foreign markets with the most cost-effective, mature and reliable products.

The traditional stamping and forming reflective cup packaging process is a common illuminant production method in China and internationally, but its cost reduction is foreseeable. To achieve a significant reduction in cost, the existing technical solutions can no longer achieve substantial changes, and the existing process must be revolutionary. After years of technical reserves and research, we have successfully applied the independently invented LED surface light source integrated packaging patent technology to the lighting system of indoor LED fluorescent tubes, thereby achieving a significant reduction in production costs and controlling the cost of the lighting system to a level similar to that of ordinary fluorescent tube lighting fixtures. This has achieved a global and historic breakthrough in cost control for LEDs entering the general lighting field, and the excellent cost-effectiveness it embodies is even more proud of the LED industry. This is a creative change in the existing technical solutions in the world. It is this change that has created an opportunity for China's LED packaging industry to surpass the world level. This is the historical mission and sacred responsibility of the rise of China's LED tube industry, and it is also a very important development opportunity for our company. The plan has now formed a small-scale production, which fully proves that the project products to be implemented have fully met the conditions for industrialization and large-scale production.

For this core technology solution, we have established a complete patent barrier and achieved complete and systematic patent protection from products to tooling, to core special equipment and supporting software development that have been invested heavily in research and development.

LED light sources have a market of about RMB 100 billion in China, and the global market size is about US$80 billion. The product manufactured by our company using the patent cluster, LED light sources, has the characteristics of flexible form and wide application range. It can be widely used in LED tubes, bulbs, spotlights, street lights, downlights, panel lights, etc. It can not only replace the guardrail tube lamps currently used in outdoor contours, but also replace the fluorescent tubes in general lighting. At present, the company has chosen LED surface light sources as the pillar project product for the development of the enterprise, which has a broad market space. The direct production cost of the application product LED tube is about RMB 75 per tube, and the product retail price is planned to be controlled at RMB 100 per tube (the average production cost price of the same tube is currently RMB 125 per tube in the industry, and the market price is RMB 160 per tube). Therefore, it is completely possible to quickly occupy the market, establish a brand, and become a leading enterprise in the industry in a short period of time. Moreover, with the expansion of production scale and the improvement of procurement system, it is completely possible to control the retail price within RMB 60 on the premise of ensuring full profit realization. Therefore, the proposal of this project and the commercialization of the product will have very important strategic significance for the rapid popularization of new light sources in society.

The typical application product of this packaging technology, LED fluorescent lamp, has the following characteristics:

no need for starter and ballast, fast start-up, no flicker, and not easy to cause eyestrain.

High luminous efficiency, mercury-free, pollution-free, and vibration-resistant.

Achieve the industry-leading level of 90 Lm/w integrated packaging using Chinese-made chips, with a CRI of over 75;

Compared with similar surface light sources, it has a wider light band, higher light efficiency, stronger light intensity, more uniform light emission and higher reliability.

The initial installation cost of the lighting system is close to the cost of the fluorescent lamp system.

COMMB-LED surface light source application product fluorescent tube diagram

Characteristic parameters of fluorescent lamps used in the project

Product Model: KX-T5-1.2M-13W

Power: 13W Input voltage (AC): AC110-260V

Color temperature : 3000-7000K Working humidity: >95%

Color rendering index : greater than 75 Working temperature: 35～45℃

Lighting angle : 120±5° Lifespan: ＞50,000 hours

Luminous flux :＞1200LM Ambient temperature:-20～+50℃

Illumination : ≥80 Lux/2.3 m2 Equivalent to T8 fluorescent lamp: 40W