Brief analysis of common elements of LED application packaging-EEWORLD

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LED application packaging technology is crucial to basic parameters such as LED heat dissipation and lifespan. This article briefly introduces and analyzes common elements of LED packaging for reference by LED-related personnel.

1. LED lead forming method

1. The bracket must be bent 2 mm away from the colloid.

2. The bracket forming must be done with a clamp or by professionals.

3. The bracket forming must be completed before welding.

4. The bracket must be formed to ensure that the pins and spacing are consistent with those on the circuit board.

2. Pay attention when bending and cutting LED pins

Because the design requires bending and cutting of the pins, when bending and cutting the pins of the LED, the position of the bending and cutting pins should be greater than 3mm from the bottom surface of the colloid.

The legs should be bent before welding.

When using LED plug-in lamps, the PCB hole spacing should correspond to the LED foot spacing.

When cutting pins, the vibration and friction of the cutting machine will generate very high voltage static electricity, so the machine must be reliably grounded and anti-static measures must be taken (an ion fan can be used to eliminate static electricity).

3. LED cleaning

Be especially careful when cleaning the colloid with chemicals, because some chemicals can damage the surface of the colloid and cause discoloration, such as trichloroethylene, acetone, etc. You can use ethanol to wipe and soak, and the time should not exceed 3 minutes at room temperature.

4. LED overcurrent protection

Overcurrent protection can be achieved by connecting a protective resistor in series with the LED to make it work stably

The resistance value calculation formula is: R = (VCC-VF) / IF

VCC is the power supply |regulator voltage, VF is the LED drive voltage, and IF is the forward current

5. LED welding conditions

1. Soldering with a soldering iron: The tip temperature of the soldering iron (maximum 30W) should not exceed 300°C, the soldering time should not exceed 3 seconds, and the soldering position should be at least 2 mm away from the colloid.

2. Wave soldering: The maximum dip soldering temperature is 260°C, the dip soldering time shall not exceed 5 seconds, and the dip soldering position shall be at least 2 mm away from the colloid.

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