LED injection molding process details

Publisher:程序界的行者Latest update time:2011-07-27 Source: OFweek半导体照明网Keywords:LED Reading articles on mobile phones Scan QR code
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Lamp- LED is encapsulated in the form of potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressed and welded LED bracket, put it into the oven to let the epoxy solidify, and then remove the LED from the cavity to form it. The LED glue potting process seems very simple, but you should also pay attention to the following aspects:

1. Install the mold strip on the aluminum boat in a certain direction. After blowing the dust, put it in an oven at 125 ℃ /40 minutes for preheating.

2. Prepare glue according to the production demand, and then stir the prepared glue evenly and put it in a vacuum oven at 45℃ /15 minutes for degassing.
3. Carry out glue potting, and then carry out initial baking (the initial baking temperature of 3φ and 5φ products is 125℃ /60 minutes; the initial baking temperature of 8φ-10φ products is 110℃ /30 minutes + 125℃ /30 minutes)
4. Demolding, and then long baking at 125℃ /6-8 hours. If the glue filling is poor, the following phenomena may occur:
1). The bracket is inserted offset, the bracket is inserted too deep, the bracket is inserted shallowly, the bracket is inserted upside down, the bracket is glued, and the bracket turns yellow (oxidation, baking temperature is too high or time is too long)
2). Bowl bubbles, pearl bubbles, linear bubbles, surface pinhole bubbles
3). Impurities, too much glue, too little glue, atomization
4). Water marks on the glue surface, colloid damage, colloid cracking (glue aging or incorrect proportion), colloid yellowing (the proportion of A glue is too large).
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