New i-ToF image sensor enables smaller 3D camera systems

New i-ToF image sensor enables smaller 3D camera systems, improving quantum efficiency while optimizing cost

Munich, Germany, March 28, 2023 - Infineon Technologies AG and pmd, a premium partner in the 3D ToF field, have jointly launched the IRS2976C Time-of-Flight (ToF) VGA sensor, a performance-enhanced version of the IRS2877C ToF VGA sensor. The sensor is a new member of the REAL3™ product family.

This product uses Infineon's new pixel technology to increase the quantum efficiency of pixels to more than 30% , reaching a level that has only been achieved with back-side illumination (BSI) sensors so far, while maintaining the cost advantage of front-side illumination (FSI) sensors. Thanks to this, the IRS2976C image sensor has become the world's first ToF image sensor to obtain Google Face ID Level 3 certification (Enhanced Level) and can operate seamlessly under the display of mobile devices.

IRS2976C Image Sensor Supports a variety of long-range, low-power use scenarios, with measurement distances up to or even beyond 10 meters. Like all other members of the REAL3™ family, each pixel of this image sensor uses Paiande's patented Suppression of Background Illumination (SBI) technology, which can provide robust data in high dynamic range (HDR) and daylight scenes.

“Our unique ToF CMOS process ensures excellent sensitivity and robustness in both indoor and outdoor environments,” said Christian Herzum, Vice President of 3D Sensing at Infineon Technologies . “In addition, our IRS2976C 3D ToF image sensor offers powerful features and outstanding flexibility for optimizing 3D camera system designs. This sensor is ideal for secure authentication in applications such as smartphones, payment terminals, smart door locks, as well as for virtual and augmented reality (AR/VR) headsets, service robots and various IoT devices.”

The IRS2976C image sensor supports a system VGA resolution of 640 x 480. With the world's smallest form factor of 23 mm² , the image sensor is easily compatible with the previous IRS2877C image sensor and can be easily upgraded. The ultra-high integration greatly reduces the amount of material used in the sensor, making it smaller and simpler to design. The new IRS2976C image sensor can be used with Infineon's latest VCSEL driver IRS9102C to help R&D personnel design smaller and lower-cost 3D camera systems.

Availability

Engineering samples of the IRS2976C image sensor are available now. The new product was demonstrated at the 2023 Mobile World Congress in Barcelona, ​​Spain.