Advanced ultrasonic lens cleaning chipset enables self-cleaning cameras and sensors

Advanced ultrasonic lens cleaning chipset enables self-cleaning cameras and sensors

Designers can use TI's ULC technology to create reliable and cost-effective small cleaning systems for automotive and industrial applications

SHANGHAI, China (January 18, 2023) – Texas Instruments (TI) (Nasdaq: TXN) today introduced advanced, specialized semiconductors with Ultrasonic Lens Cleaning (ULC) technology that enables camera systems to quickly detect and remove dirt, ice and water using tiny vibrations.

Traditionally, removing contaminants from camera lenses has required manual cleaning, which results in system downtime, or the use of various mechanical devices that can fail. TI's new ULC chipset, which includes the ULC1001 digital signal processor (DSP) and the accompanying DRV2901 piezoelectric transducer driver, uses a proprietary technology that allows the camera to quickly self-clean contaminants using precisely controlled vibrations to quickly remove debris, improving system accuracy and reducing maintenance requirements. The chipset provides designers with a compact and affordable way to use ULC in a variety of applications and different camera sizes.

“ULC can make widespread use of self-cleaning cameras and sensors a reality,” said Avi Yashar, product marketing engineer at TI . “Existing cleaning methods are costly and impractical, requiring complex mechanics, expensive electronics and extensive processing to detect contaminants and perform cleaning. As the number of cameras proliferates in applications ranging from automotive and traffic cameras to smart cities and manufacturing, there is a pressing need for a simple and cost-effective way to implement self-cleaning cameras.”

The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, temperature and fault detection without any image processing, making the ULC technology highly adaptable for use in a wide variety of camera lens designs. The chipset’s small form factor makes it possible to improve machine vision and sensing in a wide variety of applications, anywhere a camera or sensor might get dirty. To learn how it works, read the technical article “Ultrasonic Lens Cleaning: The Solid-State Technology You Didn’t Know You Need.”

“As advanced driver assistance systems (ADAS) become more sophisticated and drivers rely more on them, it’s more important than ever to keep the sensor suite functioning properly,” said Edward Sanchez, senior analyst, global automotive at TechInsights . “Dirt or foreign matter on the camera lens is just a nuisance for a rearview camera, but a critical functional and safety issue for vehicles that rely on highly accurate imaging and sensor data. This is quickly becoming a serious problem in the ADAS and autonomous driving space, and TI’s ULC approach will solve it in a practical and affordable way.”

Reduce system size and complexity with integrated solutions

Using TI's ULC chipset, there is no need for complex mechanical devices or human intervention in the lens cleaning system. The ULC1001 ultrasonic cleaning DSP with a proprietary algorithm integrates a pulse width modulator, current and voltage sense amplifiers, and an analog-to-digital converter. TI's chipset, together with the DRV2901 piezoelectric transducer driver as a companion amplifier, enables ULC in a compact package with a printed circuit board size of less than 25mm x 15mm, reducing the bill of materials while providing more functionality than discrete implementations.

Packaging, Availability, and Pricing

The ULC1001 DSP is available in production quantities now and is available on TI.com and through authorized distributors in a 4.5mm x 4.5mm, 32-pin HotRod™ Quad Flat No-Lead (QFN) package. The DRV2901 piezoelectric transducer driver is available now and is available in full tape and reel from TI.com and other channels. The evaluation module ULC1001-DRV290XEVM is available now on TI.com with multiple payment and shipping options.