Molex Continues Commitment to Shared Mission of Open Compute Project (OCP) Foundation

Molex, a leading global manufacturer of electronic solutions, is proud to continue its active participation in the promotion and development of open platforms to meet the evolving needs of the data center. Molex will be participating as a Sapphire Sponsor at the first-ever virtual Open Compute Summit, held May 12-15, 2020.

Telecommunications and data center companies are facing a continuous increase in bandwidth demand, and therefore, they all need high-density interconnect systems. To meet these needs, Molex works with customers to provide a variety of innovative connectivity solutions. Molex's full portfolio includes scalable data center solutions with excellent speed, signal integrity, EMI shielding performance, and extremely high thermal efficiency. By collaborating with industry-leading technology companies, Molex can also help customers meet and exceed 112 Gbps speed requirements and plan for next-generation needs.

As open source data becomes more important, Molex is developing products that meet the requirements of Open19. As a participant in the Open19 project, which aims to establish a new set of standards for data center servers, Molex is demonstrating a new example of OCP open standards. Such products will enable customers to enable a wide range of computing accelerators within the data center.

“By combining our core expertise and collaboration with industry-leading technology companies, we are proud to offer our customers a portfolio of innovative copper, optical and power solutions, such as the NearStack Substrate Interconnect System, while further expanding our collaboration with open platforms,” said Ryan Wade, Director of Data Center Sales, Molex.

Molex showcased the following product solutions:

  Open19 Impel Backplane Connector System for Packet19 Chassis

   QSFP-DD Pluggable System

  BiPass I/O and Backplane Cable Assemblies

   112 Gbps NearStack On-Substrate Interconnect System