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Xuzhou! Integrated circuits, a new force

Latest update time:2021-09-04 03:49
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In the Fenghuangwan Electronic Information Industry Park in Damiao Street, Xuzhou Economic and Technological Development Zone, the Zhongke Zhixin semiconductor packaging and testing project is being vigorously promoted. After the project is put into production, it will further strengthen the city's semiconductor packaging and testing industry chain.

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Recently, the Zhongke Zhixin semiconductor packaging and testing project is being vigorously promoted in the Fenghuangwan Electronic Information Industry Park in Damiao Street, Xuzhou Economic and Technological Development Zone. After the project is put into production, it will further strengthen the city's semiconductor packaging and testing industry chain.


Jiangsu Zhongke Zhixin Integrated Technology Co., Ltd. is an enterprise integrating semiconductor packaging and testing design and manufacturing. Its product positioning is the design and manufacturing of medium and high density integrated chip fan-out packaging and high frequency RF chip packaging. As a major industrial project in our city, Zhongke Zhixin covers an area of ​​50 acres and has an investment of 2 billion yuan. Construction started in September 2018. The first phase of the project currently under construction covers an area of ​​10,000 square meters and has an investment of 500 million yuan. After completion, it will form an annual production capacity of 120,000 12-inch precision-ground wafers. After the second phase is put into production, the production capacity will increase dramatically, and it is expected to achieve sales revenue of 3.2 billion yuan.


According to Zhuansun Xiaohui, deputy secretary of the Party Committee of Damiao Sub-district and deputy director of the office, the first phase of the Zhongke Zhixin project has now fully entered the internal decoration stage. In May, the entire plant can be installed with electromechanical equipment, and equipment testing and trial production are expected to be carried out in the second half of the year. In order to ensure the quality and quantity of the project construction, Damiao Sub-district has set up a special construction team stationed in the factory. Each team has a special team, all of whom are in the factory 24 hours a day to solve problems on site and make every effort to ensure that the project is put into production and achieves results as soon as possible.


It is reported that the packaging and testing project is the middle and lower reaches of the semiconductor industry, which means that its products will directly face the market, with the highest value chain, and the technical content is also very high, especially in terms of technology and high-level talents, which will bring new vitality to the Economic and Technological Development Zone.



The integrated circuit and ICT industrial base is a strategic industry that our city focuses on developing. In September 2017, our city discussed and passed the "Implementation Plan for Promoting the Development of Integrated Circuit and ICT Industries", striving to build Xuzhou into an important regional integrated circuit and ICT industrial base. In recent years, Xinhua Semiconductor, Bokang Group, Tongxin Optoelectronics, etc. have successively settled in and put into production, and major projects such as Taiwan Zhengwei High-end Mobile Phone Supply Chain, GCL Large-size Wafers, Xuzhou Semiconductor Innovation Center of the Institute of Microelectronics of the Chinese Academy of Sciences, and Huajin Semiconductor have been promoted in an orderly manner. The three major carrier platforms of Xinwei Semiconductor Accelerator, Phoenix Bay Electronic Information Industrial Park, and Jinlong Lake Science and Technology Valley have gradually taken shape.


Packaging and testing is an important part of the semiconductor industry chain, and is also a key semiconductor field for Xuzhou to develop. Based on the Zhongke Zhixin project, in the future, our city will continue to improve the integrated industry chain of integrated circuit special device manufacturing, semiconductor packaging and testing, etc.


Content Statement: Any views in this article are for discussion purposes only and do not constitute any investment advice, nor do they represent the position of this public account. Users who make investments based on this article and any other views of this public account shall bear their own risks and responsibilities. This public account does not assume any responsibility for any consequences caused by this.


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