Smaller 36V, 4A power module reduces solution size by 30%
Texas Instruments (TI) today introduced the industry's smallest 36V, 4A power module in a quad flat no-lead (QFN) package .
The TPSM53604 DC/DC step-down module ’s 5mm x 5.5mm footprint enables engineers to shrink their power supply size by 30% while reducing power losses to 50% of other comparable modules . The new power module comes with a thermal pad to optimize heat transfer, allowing engineers to simplify board mounting and layout.
The TPSM53604 operates in ambient temperatures up to 105°C , enabling rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transportation, aerospace and defense.
By pairing the TPSM53604 with compact step-down modules such as the TPSM82813 and TPSM82810, engineers can create a complete power solution from a 24-V input all the way to the point-of-load while minimizing design time and effort.
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Shrink and simplify power solutions : Its single-sided layout with a total area of 85mm2 is a smaller solution for common 24V, 4A industrial applications. The standard QFN package helps simplify design, thereby reducing time to market.
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Effective heat dissipation in high-temperature environments : 42% of the TPSM53604's QFN package area is in contact with the circuit board, enabling more efficient heat transfer than an alternative, ball grid array (BGA) package. In addition, the module's buck converter integrates MOSFETs and low drain-to-source resistance (RDS(on)), enabling 90% efficiency at 24 V to 5 V.
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Easily meet EMI standards: The TPSM53604’s integrated high-frequency bypass capacitors and lack of bond wires help engineers meet electromagnetic interference (EMI) standards set by CISPR (Committee International Special for Radio Interference) 11 Class B limits.
The TPSM53604 QF package in a 5-mm x 5.5-mm package is available now from TI and authorized distributors. The TPSM53602 (2A) and TPSM53603 (3A) modules are in production now and available from TI and authorized distributors.
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