Datasheet
DS000391
TDC-GP30
System-Integrated Solution for Ultrasonic Flow Meters
(Volume 1: General Data and Frontend Description)
v5-00
•
2020-Mai-05
This product, formerly soled by ams AG, and before that by acam-messelectronics GmbH, is now owned and
sold by ScioSence B.V.. This commercial transfer does not affect the technical specification or quality oft he
product.
UFC
Copyrights & Disclaimer
TDC-GP30
Copyright ScioSense B.V., High Tech Campus 10, 5656 AE Eindhoven, The Netherlands. Trademarks
Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner.
Devices sold by ScioSense B.V. are covered by the warranty and patent indemnification provisions
appearing in its General Terms of Trade. ScioSense B.V. makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein. ScioSense B.V. reserves the right to change
specifications and prices at any time and without notice. Therefore, prior to designing this product into a
system, it is necessary to check with ScioSense B.V. for current information. This product is intended for
use in commercial applications. Applications requiring extended temperature range, unusual
environmental requirements, or high reliability applications, such as military, medical life-support or life-
sustaining equipment are specifically not recommended without additional processing by ScioSense B.V.
for each application. This product is provided by ScioSense B.V. “AS IS” and any express or implied
warranties, including, but not limited to the implied warranties of merchantability and fitness for a
particular purpose are disclaimed.
ScioSense B.V. shall not be liable to recipient or any third party for any damages, including but not limited
to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect,
special, incidental or consequential damages, of any kind, in connection with or arising out of the
furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any
third party shall arise or flow out of ScioSense B.V. rendering of technical or other services.
RoHS Compliant & ScioSense Green Statement
RoHS Compliant: The term RoHS compliant means that ScioSense B.V. products fully comply with
current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials.
Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in
specified lead-free processes.
ScioSense Green (RoHS compliant and no Sb/Br): ScioSense Green defines that in addition to RoHS
compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do
not exceed 0.1% by weight in homogeneous material).
Important Information: The information provided in this statement represents ScioSense B.V. knowledge
and belief as of the date that it is provided. ScioSense B.V. bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information.
Efforts are underway to better integrate information from third parties. ScioSense B.V. has taken and
continues to take reasonable steps to provide representative and accurate information but may not have
conducted destructive testing or chemical analysis on incoming materials and chemicals. ScioSense B.V.
and ScioSense B.V. suppliers consider certain information to be proprietary, and thus CAS numbers and
other limited information may not be available for release
Support / Contact
For direct sales, distributor and sales representative contacts, visit the ScioSense web site at:
www.sciosense.com
For technical support you can contact the ScioSense support team:
customersupport@sciosense.com
or by phone +49-7244-74190.
Ultrasonic Flow Converter
Notational Conventions
Vol. 1
TDC-GP30
Throughout the GP30 documentation, the following stile formats are used to support efficient reading
and understanding of the documents:
▪
▪
Hexadecimal numbers are denoted by a leading 0x, e.g. 0xAF = 175 as decimal number.
Decimal numbers are given as usual.
Binary numbers are denoted by a leading 0b, e.g. 0b1101 = 13. The length of a binary
number can be given in bit (b) or Byte (B), and the four bytes of a 32b word are denoted B0,
B1, B2 and B3 where B0 is the lowest and B3 the highest byte.
▪
Abbreviations and expressions which have a special or uncommon meaning within the
context of GP30 application are listed and shortly explained in the list of abbreviations, see
following page. They are written in plain text. Whenever the meaning of an abbreviation or
expression is unclear, please refer to the glossary at the end of this document.
▪
▪
Variable names
for hard coded registers and flags are in bold. Meaning and location of
these variables is explained in the datasheet (see registers CR, SRR and SHR).
Variable names
which represent memory or code addresses are in bold italics. Many of
these addresses have a fixed value inside the ROM code, others may be freely defined by
software. Their meaning is explained in the firmware and ROM code description, and their
physical addresses can be found in the header files. These variable names are defined by
the header files and thus known to the assembler as soon as the header files are included in
the assembler source code. Note that different variable names may have the same address,
especially temporary variables.
▪
Physical variables
are in italics (real times, lengths, flows or temperatures).
1
Ultrasonic Flow Converter
Abbrevations
AM
CD
CPU
CR
CRC
DIFTOF,
DIFTOF_ALL
DR
FEP
FDB
FHL
FW
FWC
FWD
FWD-RAM
GPIO
Hit
HSO
INIT
IO
I2C
LSO
MRG
NVRAM, NVM
PI
PP
PWR
R
RAA
RAM
RI
ROM
ROM code
SHR
SPI
SRAM
SRR
SUMTOF
Task
TDC
TOF, TOF_ALL
TS
TM
UART
USM
V
ref
X,Y,Z
ZCD
Amplitude measurement
Configuration Data
Central Processing Unit
Configuration Register
Cyclic Redundancy Check
Difference of up and down ->TOF
Vol. 1
TDC-GP30
Debug Register
Frontend Processing
Frontend data buffer
First hit level (physical value
V
FHL
)
Firmware, software stored on the chip
Firmware Code
Firmware Data
Firmware Data memory
General purpose input/output
Stands for a detected wave period
High speed oscillator
Initialization process of ->CPU or -> FEP
Input/output
Inter-Integrated Circuit bus
Low speed oscillator
Measurement Rate Generator
Programmable Non-Volatile Memory
Pulse interface
Post Processing
Pulse width ratio
RAM address pointer of the CPU, can also stand for the addressed
register
Random Access Area
Random Access Memory
Remote Interface
Read Only Memory
Hard coded routines in ROM
System Handling Register
Serial Peripheral Interface
Static RAM
Status & Result Register
Sum of up and down TOF
Process, job
Time-to-digital-converter
Time of Flight
Task Sequencer
Temperature measurement
Universal Asynchronous Receiver & Transmitter
Ultrasonic measurement
Reference voltage
Internal registers of the CPU
Zero cross detection, physical level
V
ZCD
For details see the glossary in section 9.
2
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TDC-GP30_DS000391_5-00
TDC-GP30
Content
1
Vol. 1
Overview .............................................................................................................................. 1-3
1.1
1.2
1.3
Key Features ................................................................................................................. 1-3
Block diagram ............................................................................................................... 1-4
Ordering Numbers ......................................................................................................... 1-4
Electrical Characteristics ............................................................................................... 2-1
Timings ......................................................................................................................... 2-5
Pin Description .............................................................................................................. 2-9
Package Drawings ...................................................................................................... 2-11
Measuring principle ..................................................................................................... 3-13
Ultrasonic Measurement .............................................................................................. 3-17
Temperature Measurement .......................................................................................... 3-21
Chip level calibrations ................................................................................................. 3-26
Watchdog ...................................................................................................................... 4-1
Time Stamp (RTC) ........................................................................................................ 4-1
Backup .......................................................................................................................... 4-1
Clock Management ........................................................................................................ 4-1
Power Supply ................................................................................................................ 4-4
Voltage Measurement.................................................................................................... 4-6
SPI Interface ................................................................................................................. 5-1
UART Interface ............................................................................................................. 5-1
Remote Communication (Opcodes) ............................................................................... 5-3
Opcodes ....................................................................................................................... 5-3
Pulse Interface .............................................................................................................. 6-2
EEPROM Interface ........................................................................................................ 6-5
Program Area ................................................................................................................ 7-3
Random Access Area (RAA) .......................................................................................... 7-4
Configuration Registers ............................................................................................... 7-10
System Handling Register ........................................................................................... 7-21
Status Registers .......................................................................................................... 7-28
GP30-DEMO Board ....................................................................................................... 8-1
GP30 Typical Configuration ........................................................................................... 8-2
2
Characteristics & Specifications ............................................................................................ 2-1
2.1
2.2
2.3
2.4
3
Flow and Temperature Measurement .................................................................................. 3-13
3.1
3.2
3.3
3.4
4
Special Service Functions ..................................................................................................... 4-1
4.1
4.2
4.3
4.4
4.5
4.6
5
Remote Port Interfaces ......................................................................................................... 5-1
5.1
5.2
5.3
5.4
6
General Purpose IO Unit ....................................................................................................... 6-1
6.1
6.2
7
Memory Organization & CPU ................................................................................................. 7-1
7.1
7.2
7.3
7.4
7.5
8
Applications .......................................................................................................................... 8-1
8.1
8.2
TDC-GP30_DS000391_5-00
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