Fully molded package air pressure sensor

In STMicroelectronics' rich MEMS sensor product line, the next star product after the market-leading consumer motion sensor is the air pressure sensor.

STMicroelectronics has supplied more than 400 million pressure sensors to the market, and released a patented product in 2013 : the fully molded pressure sensor. Then in 2014 , it released the LPS22HBTR, the smallest package at the time, a 2x2mm fully molded pressure sensor . The record for the smallest package has been maintained to this day.

Let's take a look at what's special about the fully molded package

There is a shiny reflective silicon chip on the surface of the chip

Let’s look at the cross-section diagram

The package of a common pressure sensor (as shown on the left) has a large cavity inside. The package surface has holes (aperture diameter is above 0.3mm ) and the bonding wires between DIE and DIE , as well as DIE and substrate are exposed to the air.

Most of the space in the full mold package (as shown in the right picture) is the IC packaging material. The sensing unit is connected to the outside world through micro-holes (aperture 20um ) punched in the silicon cover . All the binding wires, keys and parts are wrapped in the packaging material like ordinary chips and are not in contact with the air.

Application convenience brought:

• Waterproof and dustproof (the surface tension of water molecules will prevent water from passing through micropores with a pore size of 20um )

• Fundamentally eliminate the hidden danger of failure of binding wires, keys and parts caused by salt spray attack

Let's take a look at the internal structure below. The sensing unit of the fully molded packaged pressure sensor is surrounded by a silicon spring impact absorption structure. This gives the gas sensor stronger impact resistance and stronger structural adaptability.

LPS22HBTR has been widely used in mobile phones and wearable products of brand manufacturers such as Huawei, Samsung, Gree, and Sharp.

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